This book brings together an international team of experts from the fields of materials science, nanotechnology and dentistry, to explain these new materials and their applications for the restoration, fixation, replacement, or regeneration of hard and soft tissues in and about the oral cavity and craniofacial region.
The main topics covered include applications in dental specialties (Orthodontics, Endodontics, Pediatric dentistry, Periodontics, Prosthodontics and Implant dentistry), salivary diagnostics using bioMEMS/NEMS systems, nanochips for oral cancer diagnosis, biomimetic nanomaterials, and nanotechnology for tooth repair and regeneration.
The editors' previous book, Emerging Nanotechnologies in Dentistry focused on the fabrication/manufacturing processes of materials and dentistry applications. This second book complements the first covers with coverage of the range of nanomaterials available today in clinical dentistry, explaining the innovative techniques and applications in all of the main clinical dental specialties.
Nanobiomaterial engineers, biomedical researchers, biomedical engineers and dental/oral pre-clinical and clinical researchers will find the comprehensive coverage essential for working with nanotechnologies and materials in both clinical and research settings.Book prepared by an interdisciplinary and international group of scientists and practitioners in the fields of nanomaterials, dental implants, medical devices and clinical practiceComprehensive professional reference for the subject covering materials fabrication and use of materials for all major diagnostic and therapeutic dental applications – repair, restoration, regeneration, implants and preventionComplements the editors' previous book on nanotechnology applications for dentistry
Convenient, concise, well-organized, and precise
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips—whether you’re refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumes Incredibly detailed: includes information distilled from hundreds of sources Easy to browse: parts are clearly organized by component type Authoritative: fact-checked by expert advisors to ensure that the information is both current and accurate Reliable: a more consistent source of information than online sources, product datasheets, and manufacturer’s tutorials Instructive: each component description provides details about substitutions, common problems, and workarounds Comprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips--whether you're refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.
Volume 2 covers signal processing, including LEDs, LCDs, audio, thyristors, digital logic, and amplification.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer's tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semiconductors; Volume 2 includes LEDs, LCDs, audio, thyristors, digital logic, and amplification; Volume 3 covers a range of sensing devices.
Convenient, concise, well-organized, and precise
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips—whether you’re refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer’s tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
With updated chapters and expanded coverage, the new edition of Emerging Nanotechnologies for Manufacturing reflects the latest developments in nanotechnologies for manufacturing and covers additional nanotechnologies applied in the medical fields, such as drug delivery systems. New chapters on graphene and smart precursors for novel nanomaterials are also added.
This important and in-depth guide will benefit a broad readership, from R&D scientists and engineers to venture capitalists.Covers nanotechnology for manufacturing techniques and applications across a variety of industriesExplores the latest developments such as nanosuspensions and nanocarriers in drug delivery systems, graphene applications, and usage of smart precursors to develop nanomaterialsProven reference guide written by leading experts in the field
A strong focus lies on the current advances in understanding bone structure and function from a materials science perspective, providing practical knowledge on how to model, simulate and predict the mechanical behavior of bone. The book presents directly applicable methods for designing and testing the performance of artificial bones and joint replacements, while addressing innovative and safe approaches to stimulated bone regeneration essential for clinical researchers.
Surface Engineered Surgical Tools and Medical Devices presents the latest information and techniques in the emerging field of surface engineered biomedical devices and surgical tools, and analyzes the interaction between nanotechnology, nanomaterials, and tools for surgical applications. Chapters of the book describe developments in coatings for heart valves, stents, hip and knee joints, cardiovascular devices, orthodontic applications, and regenerative materials such as bone substitutes. Chapters are also dedicated to the performance of surgical tools and dental tools and describe how nanostructured surfaces can be created for the purposes of improving cell adhesion between medical devices and the human body.
Based on a number of breakthroughs in SiC material scienceand fabrication technology in the 1980s and 1990s, the first SiCSchottky barrier diodes (SBDs) were released as commercial productsin 2001. The SiC SBD market has grown significantly sincethat time, and SBDs are now used in a variety of power systems,particularly switch-mode power supplies and motor controls. SiC power MOSFETs entered commercial production in 2011,providing rugged, high-efficiency switches for high-frequency powersystems. In this wide-ranging book, the authors draw on theirconsiderable experience to present both an introduction to SiCmaterials, devices, and applications and an in-depth reference forscientists and engineers working in this fast-movingfield. Fundamentals of Silicon Carbide Technologycovers basic properties of SiC materials, processing technology,theory and analysis of practical devices, and an overview of themost important systems applications. Specifically includedare:A complete discussion of SiC material properties, bulk crystalgrowth, epitaxial growth, device fabrication technology, andcharacterization techniques.Device physics and operating equations for Schottky diodes, pindiodes, JBS/MPS diodes, JFETs, MOSFETs, BJTs, IGBTs, andthyristors.A survey of power electronics applications, includingswitch-mode power supplies, motor drives, power converters forelectric vehicles, and converters for renewable energysources.Coverage of special applications, including microwave devices,high-temperature electronics, and rugged sensors.Fully illustrated throughout, the text is written by recognizedexperts with over 45 years of combined experience in SiC researchand development.
This book is intended for graduate students and researchers incrystal growth, material science, and semiconductor devicetechnology. The book is also useful for design engineers,application engineers, and product managers in areas such as powersupplies, converter and inverter design, electric vehicletechnology, high-temperature electronics, sensors, and smart gridtechnology.
This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design.
A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.
Key topics covered include:Characterization of nanostructures Bionanotechnology Nanoelectronics Micro- and nanomachining Self-assembly techniques New applications of carbon nanotubes Environmental and health impacts
This book provides an important and in-depth guide to the applications and impact of nanotechnology to different manufacturing sectors. As such, it will find a broad readership, from R&D scientists and engineers to venture capitalists.
About the Authors
Waqar Ahmed is Chair of Nanotechnology & Advanced Manufacturing and the Director of the Institute of Advanced Manufacturing and Innovation at the University of Central Lancashire, UK. He has contributed to the wider industrial adoption of surface coating solutions through fundamental research and modeling of gas phase processes in CVD and studies of tribological behavior.
Mark J. Jackson is a Professor at the Birck Nanotechnology Center and Center for Advanced Manufacturing, College of Technology at Purdue University. Dr Jackson is active in research work concerned with understanding the properties of materials in the field of microscale metal cutting, micro- and nanoabrasive machining, and laser micromachining. He is also involved in developing next generation manufacturing processes and biomedical engineering.• Explains how to use biological pathways to produce nanoelectric devices
• Presents data on new, experimental designs
• Discusses the history of carbon nanotubes and how they are synthesized to fabricate novel nanostructures (incl. data on laser ablation)
• Extensive use of illustrations, tables, and figures throughout
Imaging Informatics Professionals (IIPs) have come to play an indispensable role in modern medicine, and the scope of this profession has grown far beyond the boundaries of the PACS. A successful IIP must not only understand the PACS itself, but also have knowledge of clinical workflow, a base in several medical specialties, and a solid IT capability regarding software interactions and networking. With the introduction of a certification test for the IIP position, a single source was needed to explain the fundamentals of imaging informatics and to demonstrate how those fundamentals are applied in everyday practice. Practical Imaging Informatics describes the foundations of information technology and clinical image management, details typical daily operations, and discusses rarer complications and issues.
This classic book has set the standard for advanced study andreference in the semiconductor device field. Now completely updatedand reorganized to reflect the tremendous advances in deviceconcepts and performance, this Third Edition remains the mostdetailed and exhaustive single source of information on the mostimportant semiconductor devices. It gives readers immediate accessto detailed descriptions of the underlying physics and performancecharacteristics of all major bipolar, field-effect, microwave,photonic, and sensor devices.
Designed for graduate textbook adoptions and reference needs,this new edition includes:A complete update of the latest developmentsNew devices such as three-dimensional MOSFETs, MODFETs,resonant-tunneling diodes, semiconductor sensors, quantum-cascadelasers, single-electron transistors, real-space transfer devices,and moreMaterials completely reorganizedProblem sets at the end of each chapterAll figures reproduced at the highest quality
Physics of Semiconductor Devices, Third Edition offersengineers, research scientists, faculty, and students a practicalbasis for understanding the most important devices in use today andfor evaluating future device performance and limitations.
A Solutions Manual is available from the editorialdepartment.
The Acclaimed RF Microelectronics Best-Seller, Expanded and Updated for the Newest Architectures, Circuits, and Devices
Wireless communication has become almost as ubiquitous as electricity, but RF design continues to challenge engineers and researchers. In the 15 years since the first edition of this classic text, the demand for higher performance has led to an explosive growth of RF design techniques. In RF Microelectronics, Second Edition, Behzad Razavi systematically teaches the fundamentals as well as the state-of-the-art developments in the analysis and design of RF circuits and transceivers.
Razavi has written the second edition to reflect today’s RF microelectronics, covering key topics in far greater detail. At nearly three times the length of the first edition, the second edition is an indispensable tome for both students and practicing engineers. With his lucid prose, Razavi nowOffers a stronger tutorial focus along with hundreds of examples and problems Teaches design as well as analysis with the aid of step-by-step design procedures and a chapter dedicated to the design of a dual-band WiFi transceiver Describes new design paradigms and analysis techniques for circuits such as low-noise amplifiers, mixers, oscillators, and frequency dividers
This edition’s extensive coverage includes brand new chapters on mixers, passive devices, integer-N synthesizers, and fractional-N synthesizers. Razavi’s teachings culminate in a new chapter that begins with WiFi’s radio specifications and, step by step, designs the transceiver at the transistor level.
Coverage includesCore RF principles, including noise and nonlinearity, with ties to analog design, microwave theory, and communication systems An intuitive treatment of modulation theory and wireless standards from the standpoint of the RF IC designer Transceiver architectures such as heterodyne, sliding-IF, directconversion, image-reject, and low-IF topologies. Low-noise amplifiers, including cascode common-gate and commonsource topologies, noise-cancelling schemes, and reactance-cancelling configurations Passive and active mixers, including their gain and noise analysis and new mixer topologies Voltage-controlled oscillators, phase noise mechanisms, and various VCO topologies dealing with noisepower-tuning trade-offs All-new coverage of passive devices, such as integrated inductors, MOS varactors, and transformers A chapter on the analysis and design of phase-locked loops with emphasis on low phase noise and low spur levels Two chapters on integer-N and fractional-N synthesizers, including the design of frequency dividers Power amplifier principles and circuit topologies along with transmitter architectures, such as polar modulation and outphasing
Clear methodologies that grant protection from latchup, withinsight into the physics, technology and circuit issues involved,are in increasing demand.
This book describes CMOS and BiCMOS semiconductor technology andtheir sensitivity to present day latchup phenomena, from basicover-voltage and over-current conditions, single event latchup(SEL) and cable discharge events (CDE), to latchup dominophenomena. It contains chapters focusing on bipolar physics,latchup theory, latchup and guard ring characterization structures,characterization testing, product level test systems, product leveltesting and experimental results. Discussions on state-of-the-artsemiconductor processes, design layout, and circuit level andsystem level latchup solutions are also included, as well as:latchup semiconductor process solutions for both CMOS toBiCMOS, such as shallow trench, deep trench, retrograde wells,connecting implants, sub-collectors, heavily-doped buriedlayers, and buried grids – from single- to triple-wellCMOS; practical latchup design methods, automated and bench-levellatchup testing methods and techniques, latchup theory of logarithmresistance space, generalized alpha (a) space, beta (b)space, new latchup design methods– connecting the theoreticalto the practical analysis, and;examples of latchup computer aided design (CAD)methodologies, from design rule checking (DRC) andlogical-to-physical design, to new latchup CAD methodologiesthat address latchup for internal and external latchup on a localas well as global design level.
Latchup acts as a companion text to the author’sseries of books on ESD (electrostatic discharge) protection,serving as an invaluable reference for the professionalsemiconductor chip and system-level ESD engineer. Semiconductordevice, process and circuit designers, and quality, reliability andfailure analysis engineers will find it informative on the issuesthat confront modern CMOS technology. Practitioners in theautomotive and aerospace industries will also find it useful. Inaddition, its academic treatment will appeal to both senior andgraduate students with interests in semiconductor process, devicephysics, computer aided design and design integration.
The Plain-English Guide to Electronics and Current Flow for Every PCB Designer
Today, PCB designers must deal with issues such as crosstalk and EMI-–issues that were once associated only with components. This requires electronics knowledge that many PCB designers never gain through formal training. In PCB Currents, renowned PCB designer Douglas Brooks teaches these essentials descriptively, in plain English, with as little reliance on mathematics as possible. Building on his widely praised seminars, Brooks explains what current is, how it flows, and how it reacts. He begins by reviewing the nature of current, and then explains current flow in basic circuits, discusses sources that supply and drive current, and addresses the unique problems associated with current on PCBs. Brooks concludes by thoroughly illuminating signal integrity issues caused by current flow. He offers practical design solutions for each common type of problem, as well as for complex challenges involving very high frequency harmonics and very short wavelengths.
• Current: its fundamental nature, basic definitions, and key concepts
• Five fundamental laws of current, including Kirchoff’s law and Ohm’s law
• Basic circuit concepts: resistive circuits, reactive circuits, and impedance
• Voltage and current sources: Where electrons come from and why they move
• Current-related PCB issues: temperature, transmission lines, reflections, coupled currents, power distribution, skin effect, dielectric losses, and vias
• Solutions for signal integrity issues caused by current flow, from on-board inductance and apparent resistance changes to more complex problems
The text is written to be accessible and valuable for PCB designers at all levels of experience, whether they have engineering training or not.
This fifth edition includes an additional chapter on 'Quantum Optical Effects' where the theory of quantum optical effects in semiconductors is detailed. Besides deriving the 'semiconductor luminescence equations' and the expression for the stationary luminescence spectrum, results are presented to show the importance of Coulombic effects on the semiconductor luminescence and to elucidate the role of excitonic populations.
The book outlines the technical predicament facing state-of-the-art CMOS technology development, due to the effect of ever-increasing process-induced random/intrinsic variation in transistor performance at the sub-30-nm technology nodes. Therefore, the physical understanding of process-induced random/intrinsic variations and the technical solutions to address these issues plays a key role in new CMOS technology development. This book aims to provide the reader with a deep understanding of the major random variation sources, and the characterization of each random variation source. Furthermore, the book presents various CMOS device designs to surmount the random variation in future CMOS technology, emphasizing the applications to SRAM.
Chapters on a patients' bill of rights, and on medical education and physician training, link the book to policy issues of direct concern to the public and practitioners. Throughout the book, the authors place critical questions in their political, legal, social, economic, and ethical context. Each chapter ends with discussion points, and a multimedia bibliography directs readers to relevant films, documentaries, and case studies.
The book is aimed at a broad audience of engineering professionals, life scientists and students working in the multidisciplinary area of biomedical engineering. It explains essential principles of electrical, chemical, optical and mechanical engineering as well as biomedical science, intended for readers with a variety of scientific backgrounds. In addition, it will be valuable for medical professionals and researchers. An online tutorial developed by the authors provides learning reinforcement for students and professionals alike.Reviews of state-of-the-art molecular sensors and nanotechnologiesExplains principles of sensors and fundamental theories with homework problems at the end of each chapter to facilitate learningDemystifies the vertical integration from nanomaterials to devices designCovers practical applications the recent progress in state-of-the-art sensor technologiesIncludes case studies of important commercial productsCovers the critical issues of implantability, biocompatibility and the regulatory framework
Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.
Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.
The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.
The authorsIntroduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Offering the unique approach of applying traditional physicsconcepts to explain new phenomena, Introduction to Nanomaterialsand Devices provides readers with a solid foundation on the subjectof quantum mechanics and introduces the basic concepts ofnanomaterials and the devices fabricated from them. Discussionbegins with the basis for understanding the basic properties ofsemiconductors and gradually evolves to cover quantumstructures—including single, multiple, and quantumwells—and the properties of nanomaterial systems, such asquantum wires and dots.
Written by a renowned specialist in the field, this bookfeatures:
An introduction to the growth of bulk semiconductors,semiconductor thin films, and semiconductor nanomaterials
Information on the application of quantum mechanics tonanomaterial structures and quantum transport
Extensive coverage of Maxwell-Boltzmann, Fermi-Dirac, andBose-Einstein stastistics
An in-depth look at optical, electrical, and transportproperties
Coverage of electronic devices and optoelectronic devices
Calculations of the energy levels in periodic potentials,quantum wells, and quantum dots
Introduction to Nanomaterials and Devices provides essentialgroundwork for understanding the behavior and growth ofnanomaterials and is a valuable resource for students andpractitioners in a field full of possibilities for innovation andinvention.
Topics discussed include:
-Mathematical Foundations of Decision Support Systems
-Design and Implementation Issues
-Ethical and Legal Issues in Decision Support
-Clinical Trials of Information Interventions
-Hospital-Based Decision Support
-Real World Case Studies
The third edition of Principles of Health Interoperability includes a new part on FHIR (Fast Health Interoperability Resources), the most important new health interoperability standard for a generation. FHIR combines the best features of HL7’s v2, v3 and CDA while leveraging the latest web standards and a tight focus on implementability. FHIR can be implemented at a fraction of the price of existing alternatives and is well suited for use in mobile phone apps, cloud communications and EHRs.The book is organised into four parts. The first part covers the principles of health interoperability, why it matters, why it is hard and why models are an important part of the solution. The second part covers clinical terminology and SNOMED CT. The third part covers the main HL7 standards: v2, v3, CDA and IHE XDS. The new fourth part covers FHIR and has been contributed by Grahame Grieve, the original FHIR chief.
Provides an overview of the recent changes to the 1149.1 standard and the effect of the changes on the work of test engineers; Explains the new IEEE 1149.8.1 subsidiary standard and applications; Describes the latest updates on the supplementary IEEE testing standards.
In particular, addresses:
IEEE Std 1149.1 Digital Boundary-ScanIEEE Std 1149.4 Analog Boundary-ScanIEEE Std 1149.6 Advanced I/O TestingIEEE Std 1149.8.1 Passive Component TestingIEEE Std 1149.1-2013 The 2013 Revision of 1149.1IEEE Std 1532 In-System ConfigurationIEEE Std 1149.6-2015 The 2015 Revision of 1149.6
The intent of this book is to provide manufacturing quality professionals working in virtually any industry a quick, convenient, and comprehensive guide to properly conduct process validations that meet regulatory and certification requirements. It will aid quality technicians, engineers, managers, and others that need to plan, conduct, and monitor validation activities.
Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries.
• A practical, start-to-finish approach to consistently meeting PDN performance goals
• Understanding how signals interact with interconnects
• Identifying root causes of common problems, so you can avoid them
• Leveraging analysis tools to efficiently explore design space and optimize tradeoffs
• Analyzing impedance-related properties of series and parallel RLC circuits
• Measuring low impedance for components and entire PDN ecologies
• Predicting loop inductance from physical design features
• Reducing peak impedances from combinations of capacitors
• Understanding power and ground plane properties in the PDN interconnect
• Taming signal integrity problems when signals change return planes
• Reducing peak impedance created by on-die capacitance and package lead inductance
• Controlling transient current waveform interactions with PDN features
• Simple spreadsheet-based analysis techniques for quickly creating first-pass designs
This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.
The book progresses from a framework for budget impact analyses to an in-depth review of components and how to develop and present these in software applications and reports. Critical considerations such as uncertainty analysis and validation, and considerations for alternate interventions, such as vaccines and diagnostics, are also covered.
This book is a “must have” for the builder and budget holder, with builders benefiting from instructions to identify and estimate all necessary variables and budget holders receiving a guide to what should be included in the analyses they assess.
Digital Health: Scaling Healthcare to the World addresses the emerging trends and enabling technologies contributing to technological advances in healthcare practice in the 21st Century. These areas include generic topics such as mobile health and telemedicine, as well as specific concepts such as social media for health, wearables and quantified-self trends. Also covered are the psychological models leveraged in design of solutions to persuade us to follow some recommended actions, then the design and educational facets of the proposed innovations, as well as ethics, privacy, security, and liability aspects influencing its acceptance. Furthermore, sections on economic aspects of the proposed innovations are included, analyzing the potential business models and entrepreneurship opportunities in the domain.
• Provides an overview of the latest developments and research results in the field of printed electronics
• Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics
• Discusses the principles of the above topics, with support of examples and graphic illustrations
• Serves both as an advanced introductory to the topic and as an aid for professional development into the new field
• Includes end of chapter references and links to further reading
Practical in its scope and coverage, the authors have provided a tool-kit for the medical professional in the often complex field of medical informatics. Designed for senior clinicians, decision-makers and EHR teams, the book is of use to anyone involved in the efficient management of clinical records.
Practical Applications in Digital Signal Processing is the first DSP title to address the area that even the excellent engineering textbooks of today tend to omit. This book fills a large portion of that omission by addressing circuits and system applications that most design engineers encounter in the modern signal processing industry.
This book includes original work in the areas of Digital Data Locked Loops (DLLs), Digital Automatic Gain Control (dAGC), and the design of fast elastic store memory used for synchronizing independently clocked asynchronous data bit streams. It also contains detailed design discussions on Cascaded Integrator Comb (CIC) filters, including the seldom-covered topic of bit pruning. Other topics not extensively covered in other modern textbooks, but detailed here, include analog and digital signal tuning, complex-to-real conversion, the design of digital channelizers, and the techniques of digital frequency synthesis. This book also contains an appendix devoted to the techniques of writing mixed-language C\C++ Fortran programs. Finally, this book contains very extensive review material covering important engineering mathematical tools such as the Fourier series, the Fourier transform, the z transform, and complex variables.
Features of this book include
• Thorough coverage of the complex-to-real conversion of digital signals
• A complete tutorial on digital frequency synthesis
• Lengthy discussion of analog and digital tuning and signal translation
• Detailed coverage of the design of elastic store memory
• A comprehensive study of the design of digital data locked loops
• Complete coverage of the design of digital channelizers
• A detailed treatment on the design of digital automatic gain control
• Detailed techniques for the design of digital and multirate filters
• Extensive coverage of the CIC filter, including the topic of bit pruning
• An extensive review of complex variables
• An extensive review of the Fourier series, and continuous and discrete Fourier transforms
• An extensive review of the z transform