Convenient, concise, well-organized, and precise
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips—whether you’re refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumes Incredibly detailed: includes information distilled from hundreds of sources Easy to browse: parts are clearly organized by component type Authoritative: fact-checked by expert advisors to ensure that the information is both current and accurate Reliable: a more consistent source of information than online sources, product datasheets, and manufacturer’s tutorials Instructive: each component description provides details about substitutions, common problems, and workarounds Comprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips--whether you're refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.
Volume 2 covers signal processing, including LEDs, LCDs, audio, thyristors, digital logic, and amplification.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer's tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semiconductors; Volume 2 includes LEDs, LCDs, audio, thyristors, digital logic, and amplification; Volume 3 covers a range of sensing devices.
This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design.
A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips--whether you're refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.
Volume 3 covers components for sensing the physical world, including light, sound, heat, motion, ambient, and electrical sensors.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer's tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
Each chapter of this book is centered around projects that incorporate that particular microcontroller topic. Each project includes schematics, code, and illustrations of a working project.
Program a range of AVR chipsExtend and re-use other people’s code and circuitsInterface with USB, I2C, and SPI peripheral devicesLearn to access the full range of power and speed of the microcontrollerBuild projects including Cylon Eyes, a Square-Wave Organ, an AM Radio, a Passive Light-Sensor Alarm, Temperature Logger, and moreUnderstand what's happening behind the scenes even when using the Arduino IDE
This book picks up where Make: Electronics left off: you'll work with components like comparators, light sensors, higher-level logic chips, multiplexers, shift registers, encoders, decoders, and magnetic sensors. You'll also learn about topics like audio amplification, randomicity, as well as positive and negative feedback. With step-by-step instructions, and hundreds of color photographs and illustrations, this book will help you use -- and understand -- intermediate to advanced electronics concepts and techniques.
The Acclaimed RF Microelectronics Best-Seller, Expanded and Updated for the Newest Architectures, Circuits, and Devices
Wireless communication has become almost as ubiquitous as electricity, but RF design continues to challenge engineers and researchers. In the 15 years since the first edition of this classic text, the demand for higher performance has led to an explosive growth of RF design techniques. In RF Microelectronics, Second Edition, Behzad Razavi systematically teaches the fundamentals as well as the state-of-the-art developments in the analysis and design of RF circuits and transceivers.
Razavi has written the second edition to reflect today’s RF microelectronics, covering key topics in far greater detail. At nearly three times the length of the first edition, the second edition is an indispensable tome for both students and practicing engineers. With his lucid prose, Razavi nowOffers a stronger tutorial focus along with hundreds of examples and problems Teaches design as well as analysis with the aid of step-by-step design procedures and a chapter dedicated to the design of a dual-band WiFi transceiver Describes new design paradigms and analysis techniques for circuits such as low-noise amplifiers, mixers, oscillators, and frequency dividers
This edition’s extensive coverage includes brand new chapters on mixers, passive devices, integer-N synthesizers, and fractional-N synthesizers. Razavi’s teachings culminate in a new chapter that begins with WiFi’s radio specifications and, step by step, designs the transceiver at the transistor level.
Coverage includesCore RF principles, including noise and nonlinearity, with ties to analog design, microwave theory, and communication systems An intuitive treatment of modulation theory and wireless standards from the standpoint of the RF IC designer Transceiver architectures such as heterodyne, sliding-IF, directconversion, image-reject, and low-IF topologies. Low-noise amplifiers, including cascode common-gate and commonsource topologies, noise-cancelling schemes, and reactance-cancelling configurations Passive and active mixers, including their gain and noise analysis and new mixer topologies Voltage-controlled oscillators, phase noise mechanisms, and various VCO topologies dealing with noisepower-tuning trade-offs All-new coverage of passive devices, such as integrated inductors, MOS varactors, and transformers A chapter on the analysis and design of phase-locked loops with emphasis on low phase noise and low spur levels Two chapters on integer-N and fractional-N synthesizers, including the design of frequency dividers Power amplifier principles and circuit topologies along with transmitter architectures, such as polar modulation and outphasing
Jitter, noise, and bit error (JNB) and signal integrity (SI) have become today‘s greatest challenges in high-speed digital design. Now, there’s a comprehensive and up-to-date guide to overcoming these challenges, direct from Dr. Mike Peng Li, cochair of the PCI Express jitter standard committee.
One of the field’s most respected experts, Li has brought together the latest theory, analysis, methods, and practical applications, demonstrating how to solve difficult JNB and SI problems in both link components and complete systems. Li introduces the fundamental terminology, definitions, and concepts associated with JNB and SI, as well as their sources and root causes. He guides readers from basic math, statistics, circuit and system models all the way through final applications. Emphasizing clock and serial data communications applications, he covers JNB and SI simulation, modeling, diagnostics, debugging, compliance testing, and much more.
Recent advances show that many of the current problems with water quality can be addressed using nanosorbents, nanocatalysts, bioactive nanoparticles, nanostructured catalytic membranes, and nanoparticle enhanced filtration. The book describes these technologies in detail and demonstrates how they can provide clean drinking water in both large scale water treatment plants and in point-of-use systems. In addition, the book addresses the societal factors that may affect widespread acceptance of the applications.
Sections are also featured on carbon nanotube arrays and graphene-based sensors for contaminant sensing, nanostructured membranes for water purification, and multifunctional materials in carbon microspheres for the remediation of chlorinated hydrocarbons.Addresses both the technological aspects of delivering clean water supplies and the societal implications that affect take-upDetails how the technologies are applied in large-scale water treatment plants and in point-of-use systemsHighlights challenges and the opportunities for nanotechnology to positively influence this area of environmental protection
Clear methodologies that grant protection from latchup, with insight into the physics, technology and circuit issues involved, are in increasing demand.
This book describes CMOS and BiCMOS semiconductor technology and their sensitivity to present day latchup phenomena, from basic over-voltage and over-current conditions, single event latchup (SEL) and cable discharge events (CDE), to latchup domino phenomena. It contains chapters focusing on bipolar physics, latchup theory, latchup and guard ring characterization structures, characterization testing, product level test systems, product level testing and experimental results. Discussions on state-of-the-art semiconductor processes, design layout, and circuit level and system level latchup solutions are also included, as well as:latchup semiconductor process solutions for both CMOS to BiCMOS, such as shallow trench, deep trench, retrograde wells, connecting implants, sub-collectors, heavily-doped buried layers, and buried grids – from single- to triple-well CMOS; practical latchup design methods, automated and bench-level latchup testing methods and techniques, latchup theory of logarithm resistance space, generalized alpha (a) space, beta (b) space, new latchup design methods– connecting the theoretical to the practical analysis, and; examples of latchup computer aided design (CAD) methodologies, from design rule checking (DRC) and logical-to-physical design, to new latchup CAD methodologies that address latchup for internal and external latchup on a local as well as global design level.
Latchup acts as a companion text to the author’s series of books on ESD (electrostatic discharge) protection, serving as an invaluable reference for the professional semiconductor chip and system-level ESD engineer. Semiconductor device, process and circuit designers, and quality, reliability and failure analysis engineers will find it informative on the issues that confront modern CMOS technology. Practitioners in the automotive and aerospace industries will also find it useful. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, computer aided design and design integration.
Nanoscience research is also characterized by rapid movement within disciplines. The amount of time it takes wading through papers and chasing down academics is frustrating and wasteful and our reviewers seem to suggest this work would give an excellent starting point for their work. The current source of published data is either in journal articles, which requires highly advanced knowledge of background information, or books on the subject, which can skim over the essential details of preparations. Having a cookbook to hand to flick through and from which you may select a preparation acts as a good source of contact both to researchers and those who supervise them alike.
This book therefore supports fundamental nanoscience experimentation. It is by intention much more user-friendly than traditional published works, which too-frequently assumes state of the art knowledge. Moreover you can pick up this book and find a synthesis to suit your needs without digging through specialist papers or tracking someone down who eventually may or may not be able to help. Once you have used the recipe the book would then act as a reference guide for how to analyze these materials and what to look out for.100+ detailed recipes for synthesis of basic nanostructured materials, enables readers to pick up the book and get started on a preparation immediately.High fidelity images show how preparations should look rather than vague schematics or verbal descriptions.Sequential and user-friendly by design, so the reader won't get lost in overly detailed theory or miss out a step from ignorance. A cookbook, by design and structure the work is easy to use, familiar and compact.
Convenient, concise, well-organized, and precise
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips—whether you’re refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer’s tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
The Plain-English Guide to Electronics and Current Flow for Every PCB Designer
Today, PCB designers must deal with issues such as crosstalk and EMI-–issues that were once associated only with components. This requires electronics knowledge that many PCB designers never gain through formal training. In PCB Currents, renowned PCB designer Douglas Brooks teaches these essentials descriptively, in plain English, with as little reliance on mathematics as possible. Building on his widely praised seminars, Brooks explains what current is, how it flows, and how it reacts. He begins by reviewing the nature of current, and then explains current flow in basic circuits, discusses sources that supply and drive current, and addresses the unique problems associated with current on PCBs. Brooks concludes by thoroughly illuminating signal integrity issues caused by current flow. He offers practical design solutions for each common type of problem, as well as for complex challenges involving very high frequency harmonics and very short wavelengths.
• Current: its fundamental nature, basic definitions, and key concepts
• Five fundamental laws of current, including Kirchoff’s law and Ohm’s law
• Basic circuit concepts: resistive circuits, reactive circuits, and impedance
• Voltage and current sources: Where electrons come from and why they move
• Current-related PCB issues: temperature, transmission lines, reflections, coupled currents, power distribution, skin effect, dielectric losses, and vias
• Solutions for signal integrity issues caused by current flow, from on-board inductance and apparent resistance changes to more complex problems
The text is written to be accessible and valuable for PCB designers at all levels of experience, whether they have engineering training or not.
This classic book has set the standard for advanced study and reference in the semiconductor device field. Now completely updated and reorganized to reflect the tremendous advances in device concepts and performance, this Third Edition remains the most detailed and exhaustive single source of information on the most important semiconductor devices. It gives readers immediate access to detailed descriptions of the underlying physics and performance characteristics of all major bipolar, field-effect, microwave, photonic, and sensor devices.
Designed for graduate textbook adoptions and reference needs, this new edition includes:A complete update of the latest developments New devices such as three-dimensional MOSFETs, MODFETs, resonant-tunneling diodes, semiconductor sensors, quantum-cascade lasers, single-electron transistors, real-space transfer devices, and more Materials completely reorganized Problem sets at the end of each chapter All figures reproduced at the highest quality
Physics of Semiconductor Devices, Third Edition offers engineers, research scientists, faculty, and students a practical basis for understanding the most important devices in use today and for evaluating future device performance and limitations.
A Solutions Manual is available from the editorial department.
This book provides an overview on the particular development steps of gas insulated high-voltage switchgear, and is based on the information given with the editor’s tutorial. The theory is kept low only as much as it is needed to understand gas insulated technology, with the main focus of the book being on delivering practical application knowledge. It discusses some introductory and advanced aspects in the meaning of applications.
The start of the book presents the theory of Gas Insulated Technology, and outlines reliability, design, safety, grounding and bonding, and factors for choosing GIS. The third chapter presents the technology, covering the following in detail: manufacturing, specification, instrument transformers, Gas Insulated Bus, and the assembly process. Next, the book goes into control and monitoring, which covers local control cabinet, bay controller, control schemes, and digital communication. Testing is explained in the middle of the book before installation and energization. Importantly, operation and maintenance is discussed. This chapter includes information on repair, extensions, retrofit or upgrade, and overloading. Finally applications are covered along with concepts of layout, typical layouts, mixed technology substations, and then other topics such as life cycle assessment, environmental impact, and project management.A one-stop, complete reference text on gas insulated substations (GIS), large-capacity and long-distance electricity transmission, which are of increasing importance in the power industry today Details advanced and basic material, accessible for both existing GIS users and those planning to adopt the technology Discusses both the practical and theoretical aspects of GIS Written by acknowledged GIS experts who have been involved in the development of the technology from the start
Many makers love microcontroller platforms such as Arduino, but as the complexity increases in their projects, they need more power for applications, such as computer vision. The BeagleBone is an embedded Linux board for makers. It's got built-in networking, many inputs and outputs, and a fast processor to handle demanding tasks. This book introduces you to both the original BeagleBone and the new BeagleBone Black and gets you started with projects that take advantage of the board's processing power and its ability to interface with the outside world.
The book provides a basis for the understanding of modern semiconductor devices that havedimensions in the nanometer range, i.e. comparable to the electron de Broglie wavelength. Classical and semi-classical physics no longer gives a full description of a number of physicalprocesses. The inclusion of quantum mechanical principles becomes mandatory and provides a useful description of many physical processes in electronic, optoelectronic, and photonic heterostructure devices.
The first part of the book (Chapters 1 – 11) teaches quantum-mechanical principles, including the postulates of quantum mechanics, operators, the uncertainty principle, the Schrödinger equation, non-periodic and periodic potentials, quantum wells, and perturbation theory. The second part of the book (Chapters 12 – 20) applies these principles to semiconductor devices and discusses the density of states, semiconductor statistics, carrier concentrations, doping, tunneling, and some aspects of heterostructure devices.
The book may be of particular interest to individuals working in the fields of microelectronics, optoelectronics, and photonics with an educational background in Electrical Engineering, Applied Physics, or Materials Science.
Key new chapters have been included covering eco-toxicity, nanomedicine, informatics, and future threats. New case studies have also been added, including a chapter on the impact of nanosilver on the environment, as well as an assessment of how well lessons have been learned from the past, such as in the case of asbestos. The book also makes a business case for the importance of proactive EHS management - essential reading for existing or prospective producers of nanoscale products.Practical guidance on risk management and mitigation across different legislative frameworks worldwideReviews toxicological studies and industrial initiatives, supported by numerous case studiesIncludes extensive new material on the implications of nanotechnology for medicine, energy and food, as well as assessing future threats.
Part one focuses on the fabrication of nanomaterials for tissue engineering applications and includes chapters on engineering nanoporous biomaterials, layer-by-layer self-assembly techniques for nanostructured devices, and the synthesis of carbon based nanomaterials. Part two goes on to highlight the application of nanomaterials in soft tissue engineering and includes chapters on cardiac, neural, and cartilage tissue engineering. Finally, the use of nanomaterials in hard tissue engineering applications, including bone, dental and craniofacial tissue engineering is discussed in part three.
Nanomaterials in tissue engineering is a standard reference for researchers and tissue engineers with an interest in nanomaterials, laboratories investigating biomaterials, and academics interested in materials science, chemical engineering, biomedical engineering and biological sciences.Explores the fabrication of a variety of nanomaterials and their use across a range of tissue engineering applicationsExamines engineering nanoporous biomaterials, layer-by-layer self-assembly techniques for nanostructured devices, and the synthesis of carbon based nanomaterialsHighlights the application of nanomaterials in soft tissue engineering and includes chapters on cardiac, neural, and cartilage tissue engineering
The multidisciplinary nature of this field – intersecting engineering, physics, chemistry, biology, microtechnology and biotechnology – means that the community of engineers and scientists now engaged in developing microfluidic devices has entered the field from a variety of different backgrounds.
Micromixers is uniquely comprehensive, in that it deals not only with the problems that are directly related to fluidics as a discipline (aspects such as mass transport, molecular diffusion, electrokinetic phenomena, flow instabilities, etc.) but also with the practical issues of fabricating micomixers and building them into microsystems and lab-on-chip assemblies.With practical applications to the design of systems vital in modern communications, medicine and industry this book has already established itself as a key reference in an emerging and important field.
The 2e includes coverage of a broader range of fabrication techniques, additional examples of fully realized devices for each type of micromixer and a substantially extended section on industrial applications, including recent and emerging applications.Introduces the design and applications of micromixers for a broad audience across chemical engineering, electronics and the life sciences, and applications as diverse as lab-on-a-chip, ink jet printing, pharmaceutical manufacturing and DNA analysis Helps engineers and scientists to unlock the potential of micromixers by explaining both the scientific (microfluidics) aspects and the engineering involved in building and using successful microscale systems and devices with micromixersThe author's applied approach combines experience-based discussion of the challenges and pitfalls of using micromixers, with proposals for how to overcome them
Concerning sub-micron feature manufacture, the book explains: the philosophy of micro/ nanofabrication for integrated circuit industry; thin film deposition; (waveguide, plastic, semiconductor) material processing; packaging; interconnects; stress (e.g., thin film residual); economic; and environmental aspects.
Micro/nanomechanical sensors and actuators are explained in depth with information on applications, materials (incl. functional polymers), methods, testing, fabrication, integration, reliability, magnetic microstructures, etc.Shows engineers & students how to evaluate the potential value of current and nearfuture manufacturing processes for miniaturized systems in industrial environmentsExplains the top-down and bottom up approaches to nanotechnology, nanostructures fabricated with beams, nano imprinting methods, nanoparticle manufacturing (and their health aspects), nanofeature analysis, and connecting nano to micro to macroDiscusses issues for practical application cases; possibilities of dimension precision; large volume manufacturing of micro- & nanostructures (machines, materials, costs) Explains applications of Microsystems for information technology, e.g.: data recording (camera, microphone), storage (memories, CDs), communication; computing; and displays (beamers, LCD, TFT) Case studies are given for sensors, resonators, probes, transdermal medical systems, micro- pumps & valves, inkjets, DNA-analysis, lab-on-a-chip, & micro-cooling
Important new applications for this technology (such as wind turbines, electric propulsion systems for large ships, etc.) are addressed and the book is illustrated with a large number of informative and detailed photographs, provided by various companies at the leading edge of research and applications in the field.
Part one looks at the properties of different ceramic nanocomposites, including thermal shock resistance, flame retardancy, magnetic and optical properties as well as failure mechanisms. Part two deals with the different types of ceramic nanocomposites, including the use of ceramic particles in metal matrix composites, carbon nanotube-reinforced glass-ceramic matrix composites, high temperature superconducting ceramic nanocomposites and ceramic particle nanofluids. Part three details the processing of nanocomposites, including the mechanochemical synthesis of metallic–ceramic composite powders, sintering of ultrafine and nanosized ceramic and metallic particles and the surface treatment of carbon nanotubes using plasma technology. Part four explores the applications of ceramic nanocomposites in such areas as energy production and the biomedical field.
With its distinguished editors and international team of expert contributors, Ceramic nanocomposites is a technical guide for professionals requiring knowledge of ceramic nanocomposites, and will also offer a deeper understanding of the subject for researchers and engineers within any field dealing with these materials.Reviews the structure and properties of ceramic nanocomposites as well as their manufacturing and applicationsExamines properties of different ceramic nanocomposites, as well as failure mechanismsDetails the processing of nanocomposites and explores the applications of ceramic nanocomposites in areas such as energy production and the biomedical field
Real-world case studies are included, e.g. the discussion of a leading chemical company's unusual pairing with the USA's largest environmental NGO, and an innovative program designed for small- to mid-sized businesses, which became a model approach for proactive nanotechnology EHS risk management.Considers the potential of nanotechnology from multiple perspectives (NGO, insurance industry, small business, etc)Provides guidance and advice for appropriate, proactive risk management strategiesReviews toxicological studies and industrial initiatives, documented with actual case studiesOf significant interest to CEOs/CTOs of technology companies (SMEs), Health and Safety officers of technology companies (SMEs), Government officials (HSE), Toxicology experts, and venture capitalists
As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge.
Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy.
The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includesNew advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering
High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.
Poly(Ethylene Terephthalate) Based Blends, Composites and Nanocompositesfills this gap and systematically guides the reader through all aspects of PET and its blends, composites and nanocomposites. It covers theoretical fundamentals, nanocomposites preparation, modification techniques, structure-property relationships, characterisation of the different blends and composites, and material choice for specific applications.
Consisting of contributions from experts in the field this book is a useful reference for the researchers and engineers working on the development and characterization of PET materials as well as on implementing them in real-world products. It can also be used as a standard reference for deeper insight in the mechanical, thermal, thermo-mechanical and visco-elastic aspects in product design decisions.Provides a systematic overview on all types of poly(ethylene) terephthalate (PET) based blends, composites and nanocompositesInforms about characterization, structure-property relationships and types of modificationsLinks material properties to specific applications, enabling engineers to make the best material choice to increase product performance and cost efficiency, in industries ranging from aerospace to energy
The available books on semiconductor science and technology cannot afford to devote even an entire chapter to photoemissions from optoelectronic materials, although its importance in photoemission spectroscopy is extremely well known. This book deals totally with the photoemission from optoelectronic materials and their nanostructures (ultrathin films, quantum wires, superlattices, etc.).
The physics of low dimensional semiconductor structures, including heterostructures, superlattices, quantum wells, wires and dots is reviewed and their modeling is discussed in detail. The truly exceptional material, Graphene, is reviewed; its functionalization and Van der Waals interactions are included here. Recent research on optical studies of quantum dots and on the physical properties of one-dimensional quantum wires is also reported. Chapters on fabrication of nanowire – based nanogap devices by the dielectrophoretic assembly approach. The broad spectrum of research reported here incorporates chapters on nanoengineering and nanophysics. In its presentation of tutorial chapters as well as advanced research on nanostructures, this book is ideally suited to meet the needs of newcomers to the field as well as experienced researchers interested in viewing colleagues’ recent advances.
Writing from the perspective of a practicing SI engineer and team lead, Greg Edlund of IBM presents deep knowledge and quantitative techniques for making better decisions about digital interface design. Edlund shares his insights into how and why digital interfaces fail, revealing how fundamental sources of pathological effects can combine to create fault conditions. You won’t just learn Edlund’s expert techniques for avoiding failures: you’ll learn how to develop the right approach for your own projects and environment.
• Systematically ensure that interfaces will operate with positive timing margin over the product’s lifetime–without incurring excess cost
• Understand essential chip-to-chip timing concepts in the context of signal integrity
• Collect the right information upfront, so you can analyze new designs more effectively
• Review the circuits that store information in CMOS state machines–and how they fail
• Learn how to time common-clock, source synchronous, and high-speed serial transfers
• Thoroughly understand how interconnect electrical characteristics affect timing: propagation delay, impedance profile, crosstalk, resonances, and frequency-dependent loss
• Model 3D discontinuities using electromagnetic field solvers
• Walk through four case studies: coupled differential vias, land grid array connector, DDR2 memory data transfer, and PCI Express channel
• Appendices present a refresher on SPICE modeling and a high-level conceptual framework for electromagnetic field behavior
Objective, realistic, and practical, this is the signal integrity resource engineers have been searching for.
About the Author xix
About the Cover xx
Chapter 1: Engineering Reliable Digital Interfaces 1
Chapter 2: Chip-to-Chip Timing 13
Chapter 3: Inside IO Circuits 39
Chapter 4: Modeling 3D Discontinuities 73
Chapter 5: Practical 3D Examples 101
Chapter 6: DDR2 Case Study 133
Chapter 7: PCI Express Case Study 175
Appendix A: A Short CMOS and SPICE Primer 209
Appendix B: A Stroll Through 3D Fields 219
The hot embossing process for replicating microstructures was developed by the Forschungszentrum Karlsruhe (Karlsruhe Institute of Technology) where the author is head of the Nanoreplication Group. Worgull fills a gap in existing information by fully detailing the technology and techniques of hot embossing. He also covers nanoimprinting, a process related to hot embossing, with examples of actual research topics and new applications in nanoreplication.
*A practical and theoretical guide to selecting the materials, machinery and processes involved in microreplication using hot embossing techniques.
*Compares different replication processes such as: micro injection molding, micro thermoforming, micro hot embossing, and nanoimprinting
*Details commercially available hot embossing machinery and components like tools and mold inserts
The book describes the structure of metallic nanoparticles, the experimental and theoretical techniques by which this is determined, and the models employed to facilitate understanding. The various methods for the production of nanoparticles are outlined. It surveys the properties of clusters and the methods of characterisation, such as photoionization, optical spectroscopy, chemical reactivity and magnetic behaviour, and discusses element-specific information that can be extracted by synchrotron-based techniques such as EXAFS, XMCD and XMLD. The properties of clusters can vary depending on whether they are free, deposited on a surface or embedded in a matrix of another material; these issues are explored. Clusters on a surface can be formed by the diffusion and aggregation of atoms; ways of modelling these processes are described. Finally we look at nanotechnology and examine the science behind the potential of metallic nanoparticles in chemical synthesis, catalysis, the magnetic separation of biomolecules, the detection of DNA, the controlled release of molecules and their relevance to data storage.
The book addresses a wide audience. There was a huge development of the subject beginning in the mid-1980s where researchers began to study the properties of free nanoparticle and models were developed to describe the observations. The newcomer is introduced to the established models and techniques of the field without the need to refer to other sources to make the material accessible. It then takes the reader through to the latest research and provides a comprehensive list of references for those who wish to pursue particular aspects in more detail. It will also be an invaluable handbook for the expert in a particular aspect of nanoscale research who wishes to acquire knowledge of other areas.
The authors are specialists in different aspects of the subject with expertise in physics and chemistry, experimental techniques and computational modelling, and in interdisciplinary research. They have collaborated in research. They have also collaborated in writing this book, with the aim from the outset of making it is a coherent whole rather than a series of independent loosely connected articles.
* Appeals to a wide audience
* Provides an introduction to established models and techniques in the field
* Comprehensive list of references
Digital designs once built in custom silicon are increasingly implemented in field programmable gate arrays (FPGAs). Effective FPGA system design requires a strong understanding of VLSI issues and constraints, and an understanding of the latest FPGA-specific techniques. In this book, Princeton University's Wayne Wolf covers everything FPGA designers need to know about all these topics: both the "how" and the "why."
Wolf begins by introducing the essentials of VLSI: fabrication, circuits, interconnects, combinational and sequential logic design, system architectures, and more. Next, he demonstrates how to reflect this VLSI knowledge in a state-of-the-art design methodology that leverages FPGA's most valuable characteristics while mitigating its limitations. Coverage includes:How VLSI characteristics affect FPGAs and FPGA-based logic design How classical logic design techniques relate to FPGA-based logic design Understanding FPGA fabrics: the basic programmable structures of FPGAs Specifying and optimizing logic to address size, speed, and power consumption Verilog, VHDL, and software tools for optimizing logic and designs The structure of large digital systems, including register-transfer design methodology Building large-scale platform and multi-FPGA systems A start-to-finish DSP case study addressing a wide range of design problems
Professional Technical Reference
Upper Saddle River, NJ 07458
- Recent advances in bulk , thin film and nanowire growth of ZnO (including MBE, MOCVD and PLD),
- The characterization of the resulting material (including the related ternary systems ZgMgO and ZnCdO),
- Improvements in device processing modules (including ion implantation for doping and isolation ,Ohmic and Schottky contacts , wet and dry etching),
- The role of impurities and defects on materials properties
- Applications of ZnO in UV light emitters/detectors, gas, biological and chemical-sensing, transparent electronics, spintronics and thin film
Because you're not writing programs--rather, you're designing a chip whose sole purpose is to do what you tell it--it's faster than anything you can do in code. With Make: FPGAs, you'll learn how to break down problems into something that can be solved on an FPGA, design the logic that will run on your FPGA, and hook up electronic components to create finished projects.
The CMOS (Complementary Metal-Oxide-Semiconductor) process flow is the focus of the discussion and is covered in ten chapters. The vast majority of chips made today are fabricated using this general method. In order to ensure that all readers are comfortable with the vocabulary, the first chapter carefully and clearly introduces the science concepts found in later chapters. A chapter is devoted to pointing out the differences in other manufacturing methods, such as the gallium arsenide technology that produces chips for cell phones. In addition, a chapter describing the nature of the semiconductor industry from a business perspective is included.
"The entire process of making a chip is surprisingly easy to understand. The part of the story that defies belief is the tiny dimensions: the conducting wires and other structures on a chip are more than a hundred times thinner than a hair - and getting thinner with every new chip design."Authors are actual engineers who have a broad range of exposure and experience with chip technologyContains a unique chapter describing the nature of the semiconductor industry from a business perspective
From the Reviews...
"This handbook will be a valuable resource for many academic libraries. Many engineering librarians who work with a variety of programs (including, but not limited to Materials Engineering) should include this work in their collection. My recommendation is to add this work to any collection that serves a campus with a materials/manufacturing/electrical/computer engineering programs and campuses with departments of physics and/or chemistry with large graduate-level enrollment."
—Randy Wallace, Department Head, Discovery Park Library, University of North Texas
Following a short introduction to the working principles of laser diodes, the book describes the basics of laser diode beams and beam propagation, including Zemax modeling of a Gaussian beam propagating through a lens. The core of the book is concerned with laser diode beam manipulations: collimating and focusing, circularization and astigmatism correction, coupling into a single mode optical fiber, diffractive optics and beam shaping, and manipulation of multi transverse mode beams. The final chapter of the book covers beam characterization methods, describing the measurement of spatial and spectral properties, including wavelength and linewidth measurement techniques.
The book is a significantly revised and expanded version of the title Laser Diode Beam Basics, Manipulations and Characterizations by the same author. New topics introduced in this volume include: laser diode types and working principles, non-paraxial Gaussian beam, Zemax modeling, numerical analysis of a laser diode beam, spectral property characterization methods, and power and energy characterization techniques. The book approaches the subject in a practical way with mathematical content kept to the minimum level required, making the book a convenient reference for laser diode users.