Convenient, concise, well-organized, and precise
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips—whether you’re refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumes Incredibly detailed: includes information distilled from hundreds of sources Easy to browse: parts are clearly organized by component type Authoritative: fact-checked by expert advisors to ensure that the information is both current and accurate Reliable: a more consistent source of information than online sources, product datasheets, and manufacturer’s tutorials Instructive: each component description provides details about substitutions, common problems, and workarounds Comprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips--whether you're refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.
Volume 2 covers signal processing, including LEDs, LCDs, audio, thyristors, digital logic, and amplification.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer's tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semiconductors; Volume 2 includes LEDs, LCDs, audio, thyristors, digital logic, and amplification; Volume 3 covers a range of sensing devices.
Convenient, concise, well-organized, and precise
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips—whether you’re refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer’s tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
Based on a number of breakthroughs in SiC material scienceand fabrication technology in the 1980s and 1990s, the first SiCSchottky barrier diodes (SBDs) were released as commercial productsin 2001. The SiC SBD market has grown significantly sincethat time, and SBDs are now used in a variety of power systems,particularly switch-mode power supplies and motor controls. SiC power MOSFETs entered commercial production in 2011,providing rugged, high-efficiency switches for high-frequency powersystems. In this wide-ranging book, the authors draw on theirconsiderable experience to present both an introduction to SiCmaterials, devices, and applications and an in-depth reference forscientists and engineers working in this fast-movingfield. Fundamentals of Silicon Carbide Technologycovers basic properties of SiC materials, processing technology,theory and analysis of practical devices, and an overview of themost important systems applications. Specifically includedare:A complete discussion of SiC material properties, bulk crystalgrowth, epitaxial growth, device fabrication technology, andcharacterization techniques.Device physics and operating equations for Schottky diodes, pindiodes, JBS/MPS diodes, JFETs, MOSFETs, BJTs, IGBTs, andthyristors.A survey of power electronics applications, includingswitch-mode power supplies, motor drives, power converters forelectric vehicles, and converters for renewable energysources.Coverage of special applications, including microwave devices,high-temperature electronics, and rugged sensors.Fully illustrated throughout, the text is written by recognizedexperts with over 45 years of combined experience in SiC researchand development.
This book is intended for graduate students and researchers incrystal growth, material science, and semiconductor devicetechnology. The book is also useful for design engineers,application engineers, and product managers in areas such as powersupplies, converter and inverter design, electric vehicletechnology, high-temperature electronics, sensors, and smart gridtechnology.
This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design.
A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.
This classic book has set the standard for advanced study andreference in the semiconductor device field. Now completely updatedand reorganized to reflect the tremendous advances in deviceconcepts and performance, this Third Edition remains the mostdetailed and exhaustive single source of information on the mostimportant semiconductor devices. It gives readers immediate accessto detailed descriptions of the underlying physics and performancecharacteristics of all major bipolar, field-effect, microwave,photonic, and sensor devices.
Designed for graduate textbook adoptions and reference needs,this new edition includes:A complete update of the latest developmentsNew devices such as three-dimensional MOSFETs, MODFETs,resonant-tunneling diodes, semiconductor sensors, quantum-cascadelasers, single-electron transistors, real-space transfer devices,and moreMaterials completely reorganizedProblem sets at the end of each chapterAll figures reproduced at the highest quality
Physics of Semiconductor Devices, Third Edition offersengineers, research scientists, faculty, and students a practicalbasis for understanding the most important devices in use today andfor evaluating future device performance and limitations.
A Solutions Manual is available from the editorialdepartment.
The Acclaimed RF Microelectronics Best-Seller, Expanded and Updated for the Newest Architectures, Circuits, and Devices
Wireless communication has become almost as ubiquitous as electricity, but RF design continues to challenge engineers and researchers. In the 15 years since the first edition of this classic text, the demand for higher performance has led to an explosive growth of RF design techniques. In RF Microelectronics, Second Edition, Behzad Razavi systematically teaches the fundamentals as well as the state-of-the-art developments in the analysis and design of RF circuits and transceivers.
Razavi has written the second edition to reflect today’s RF microelectronics, covering key topics in far greater detail. At nearly three times the length of the first edition, the second edition is an indispensable tome for both students and practicing engineers. With his lucid prose, Razavi nowOffers a stronger tutorial focus along with hundreds of examples and problems Teaches design as well as analysis with the aid of step-by-step design procedures and a chapter dedicated to the design of a dual-band WiFi transceiver Describes new design paradigms and analysis techniques for circuits such as low-noise amplifiers, mixers, oscillators, and frequency dividers
This edition’s extensive coverage includes brand new chapters on mixers, passive devices, integer-N synthesizers, and fractional-N synthesizers. Razavi’s teachings culminate in a new chapter that begins with WiFi’s radio specifications and, step by step, designs the transceiver at the transistor level.
Coverage includesCore RF principles, including noise and nonlinearity, with ties to analog design, microwave theory, and communication systems An intuitive treatment of modulation theory and wireless standards from the standpoint of the RF IC designer Transceiver architectures such as heterodyne, sliding-IF, directconversion, image-reject, and low-IF topologies. Low-noise amplifiers, including cascode common-gate and commonsource topologies, noise-cancelling schemes, and reactance-cancelling configurations Passive and active mixers, including their gain and noise analysis and new mixer topologies Voltage-controlled oscillators, phase noise mechanisms, and various VCO topologies dealing with noisepower-tuning trade-offs All-new coverage of passive devices, such as integrated inductors, MOS varactors, and transformers A chapter on the analysis and design of phase-locked loops with emphasis on low phase noise and low spur levels Two chapters on integer-N and fractional-N synthesizers, including the design of frequency dividers Power amplifier principles and circuit topologies along with transmitter architectures, such as polar modulation and outphasing
Clear methodologies that grant protection from latchup, withinsight into the physics, technology and circuit issues involved,are in increasing demand.
This book describes CMOS and BiCMOS semiconductor technology andtheir sensitivity to present day latchup phenomena, from basicover-voltage and over-current conditions, single event latchup(SEL) and cable discharge events (CDE), to latchup dominophenomena. It contains chapters focusing on bipolar physics,latchup theory, latchup and guard ring characterization structures,characterization testing, product level test systems, product leveltesting and experimental results. Discussions on state-of-the-artsemiconductor processes, design layout, and circuit level andsystem level latchup solutions are also included, as well as:latchup semiconductor process solutions for both CMOS toBiCMOS, such as shallow trench, deep trench, retrograde wells,connecting implants, sub-collectors, heavily-doped buriedlayers, and buried grids – from single- to triple-wellCMOS; practical latchup design methods, automated and bench-levellatchup testing methods and techniques, latchup theory of logarithmresistance space, generalized alpha (a) space, beta (b)space, new latchup design methods– connecting the theoreticalto the practical analysis, and;examples of latchup computer aided design (CAD)methodologies, from design rule checking (DRC) andlogical-to-physical design, to new latchup CAD methodologiesthat address latchup for internal and external latchup on a localas well as global design level.
Latchup acts as a companion text to the author’sseries of books on ESD (electrostatic discharge) protection,serving as an invaluable reference for the professionalsemiconductor chip and system-level ESD engineer. Semiconductordevice, process and circuit designers, and quality, reliability andfailure analysis engineers will find it informative on the issuesthat confront modern CMOS technology. Practitioners in theautomotive and aerospace industries will also find it useful. Inaddition, its academic treatment will appeal to both senior andgraduate students with interests in semiconductor process, devicephysics, computer aided design and design integration.
The Plain-English Guide to Electronics and Current Flow for Every PCB Designer
Today, PCB designers must deal with issues such as crosstalk and EMI-–issues that were once associated only with components. This requires electronics knowledge that many PCB designers never gain through formal training. In PCB Currents, renowned PCB designer Douglas Brooks teaches these essentials descriptively, in plain English, with as little reliance on mathematics as possible. Building on his widely praised seminars, Brooks explains what current is, how it flows, and how it reacts. He begins by reviewing the nature of current, and then explains current flow in basic circuits, discusses sources that supply and drive current, and addresses the unique problems associated with current on PCBs. Brooks concludes by thoroughly illuminating signal integrity issues caused by current flow. He offers practical design solutions for each common type of problem, as well as for complex challenges involving very high frequency harmonics and very short wavelengths.
• Current: its fundamental nature, basic definitions, and key concepts
• Five fundamental laws of current, including Kirchoff’s law and Ohm’s law
• Basic circuit concepts: resistive circuits, reactive circuits, and impedance
• Voltage and current sources: Where electrons come from and why they move
• Current-related PCB issues: temperature, transmission lines, reflections, coupled currents, power distribution, skin effect, dielectric losses, and vias
• Solutions for signal integrity issues caused by current flow, from on-board inductance and apparent resistance changes to more complex problems
The text is written to be accessible and valuable for PCB designers at all levels of experience, whether they have engineering training or not.
This fifth edition includes an additional chapter on 'Quantum Optical Effects' where the theory of quantum optical effects in semiconductors is detailed. Besides deriving the 'semiconductor luminescence equations' and the expression for the stationary luminescence spectrum, results are presented to show the importance of Coulombic effects on the semiconductor luminescence and to elucidate the role of excitonic populations.
The book outlines the technical predicament facing state-of-the-art CMOS technology development, due to the effect of ever-increasing process-induced random/intrinsic variation in transistor performance at the sub-30-nm technology nodes. Therefore, the physical understanding of process-induced random/intrinsic variations and the technical solutions to address these issues plays a key role in new CMOS technology development. This book aims to provide the reader with a deep understanding of the major random variation sources, and the characterization of each random variation source. Furthermore, the book presents various CMOS device designs to surmount the random variation in future CMOS technology, emphasizing the applications to SRAM.
The book is aimed at a broad audience of engineering professionals, life scientists and students working in the multidisciplinary area of biomedical engineering. It explains essential principles of electrical, chemical, optical and mechanical engineering as well as biomedical science, intended for readers with a variety of scientific backgrounds. In addition, it will be valuable for medical professionals and researchers. An online tutorial developed by the authors provides learning reinforcement for students and professionals alike.Reviews of state-of-the-art molecular sensors and nanotechnologiesExplains principles of sensors and fundamental theories with homework problems at the end of each chapter to facilitate learningDemystifies the vertical integration from nanomaterials to devices designCovers practical applications the recent progress in state-of-the-art sensor technologiesIncludes case studies of important commercial productsCovers the critical issues of implantability, biocompatibility and the regulatory framework
Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.
Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.
The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.
The authorsIntroduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Offering the unique approach of applying traditional physicsconcepts to explain new phenomena, Introduction to Nanomaterialsand Devices provides readers with a solid foundation on the subjectof quantum mechanics and introduces the basic concepts ofnanomaterials and the devices fabricated from them. Discussionbegins with the basis for understanding the basic properties ofsemiconductors and gradually evolves to cover quantumstructures—including single, multiple, and quantumwells—and the properties of nanomaterial systems, such asquantum wires and dots.
Written by a renowned specialist in the field, this bookfeatures:
An introduction to the growth of bulk semiconductors,semiconductor thin films, and semiconductor nanomaterials
Information on the application of quantum mechanics tonanomaterial structures and quantum transport
Extensive coverage of Maxwell-Boltzmann, Fermi-Dirac, andBose-Einstein stastistics
An in-depth look at optical, electrical, and transportproperties
Coverage of electronic devices and optoelectronic devices
Calculations of the energy levels in periodic potentials,quantum wells, and quantum dots
Introduction to Nanomaterials and Devices provides essentialgroundwork for understanding the behavior and growth ofnanomaterials and is a valuable resource for students andpractitioners in a field full of possibilities for innovation andinvention.
Provides an overview of the recent changes to the 1149.1 standard and the effect of the changes on the work of test engineers; Explains the new IEEE 1149.8.1 subsidiary standard and applications; Describes the latest updates on the supplementary IEEE testing standards.
In particular, addresses:
IEEE Std 1149.1 Digital Boundary-ScanIEEE Std 1149.4 Analog Boundary-ScanIEEE Std 1149.6 Advanced I/O TestingIEEE Std 1149.8.1 Passive Component TestingIEEE Std 1149.1-2013 The 2013 Revision of 1149.1IEEE Std 1532 In-System ConfigurationIEEE Std 1149.6-2015 The 2015 Revision of 1149.6
Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries.
• A practical, start-to-finish approach to consistently meeting PDN performance goals
• Understanding how signals interact with interconnects
• Identifying root causes of common problems, so you can avoid them
• Leveraging analysis tools to efficiently explore design space and optimize tradeoffs
• Analyzing impedance-related properties of series and parallel RLC circuits
• Measuring low impedance for components and entire PDN ecologies
• Predicting loop inductance from physical design features
• Reducing peak impedances from combinations of capacitors
• Understanding power and ground plane properties in the PDN interconnect
• Taming signal integrity problems when signals change return planes
• Reducing peak impedance created by on-die capacitance and package lead inductance
• Controlling transient current waveform interactions with PDN features
• Simple spreadsheet-based analysis techniques for quickly creating first-pass designs
This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.
• Provides an overview of the latest developments and research results in the field of printed electronics
• Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics
• Discusses the principles of the above topics, with support of examples and graphic illustrations
• Serves both as an advanced introductory to the topic and as an aid for professional development into the new field
• Includes end of chapter references and links to further reading
Practical Applications in Digital Signal Processing is the first DSP title to address the area that even the excellent engineering textbooks of today tend to omit. This book fills a large portion of that omission by addressing circuits and system applications that most design engineers encounter in the modern signal processing industry.
This book includes original work in the areas of Digital Data Locked Loops (DLLs), Digital Automatic Gain Control (dAGC), and the design of fast elastic store memory used for synchronizing independently clocked asynchronous data bit streams. It also contains detailed design discussions on Cascaded Integrator Comb (CIC) filters, including the seldom-covered topic of bit pruning. Other topics not extensively covered in other modern textbooks, but detailed here, include analog and digital signal tuning, complex-to-real conversion, the design of digital channelizers, and the techniques of digital frequency synthesis. This book also contains an appendix devoted to the techniques of writing mixed-language C\C++ Fortran programs. Finally, this book contains very extensive review material covering important engineering mathematical tools such as the Fourier series, the Fourier transform, the z transform, and complex variables.
Features of this book include
• Thorough coverage of the complex-to-real conversion of digital signals
• A complete tutorial on digital frequency synthesis
• Lengthy discussion of analog and digital tuning and signal translation
• Detailed coverage of the design of elastic store memory
• A comprehensive study of the design of digital data locked loops
• Complete coverage of the design of digital channelizers
• A detailed treatment on the design of digital automatic gain control
• Detailed techniques for the design of digital and multirate filters
• Extensive coverage of the CIC filter, including the topic of bit pruning
• An extensive review of complex variables
• An extensive review of the Fourier series, and continuous and discrete Fourier transforms
• An extensive review of the z transform
Nanotechnology: An Introduction, Second Edition,is ideal for the newcomer to nanotechnology, someone who also brings a strong background in one of the traditional disciplines, such as physics, mechanical or electrical engineering, or chemistry or biology, or someone who has experience working in microelectromechanical systems (MEMS) technology.
This book brings together the principles, theory, and practice of nanotechnology, giving a broad, yet authoritative, introduction to the possibilities and limitations of this exciting and rapidly developing field. The book's author, Prof Ramsden, also discusses design, manufacture, and applications and their impact on a wide range of nanotechnology areas.Provides an overview of the rapidly growing and developing field of nanotechnologyFocuses on key essentials, and structured around a robust anatomy of the subjectBrings together the principles, theory, and practice of nanotechnology, giving a broad, yet authoritative, introduction to the possibilities and limitations of this exciting and rapidly developing field
Other key features include:operation and maintenance requirements with information onrepair processes, duration, and different monitoring systemsenabling the achievement of reliable and safe operation;a wide variety of realized applications from across the worldover the past 35 years, illustrating typical fields of applicationthrough descriptions of real projects that the author has workedon; andfuture application possibilities in a smart transmissionnetwork, used for solving power transmission problems.
This is an essential reference for engineers involved inplanning and executing bulk power transmission projects overground,in tunnels or buried. It offers a concise summary of all areas ofthe subject and is the perfect aid for utility power engineers,consulting engineers and manufacturers worldwide.
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips--whether you're refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.
Volume 3 covers components for sensing the physical world, including light, sound, heat, motion, ambient, and electrical sensors.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer's tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
Each chapter of this book is centered around projects that incorporate that particular microcontroller topic. Each project includes schematics, code, and illustrations of a working project.
Program a range of AVR chipsExtend and re-use other people’s code and circuitsInterface with USB, I2C, and SPI peripheral devicesLearn to access the full range of power and speed of the microcontrollerBuild projects including Cylon Eyes, a Square-Wave Organ, an AM Radio, a Passive Light-Sensor Alarm, Temperature Logger, and moreUnderstand what's happening behind the scenes even when using the Arduino IDE
Jitter, noise, and bit error (JNB) and signal integrity (SI) have become today‘s greatest challenges in high-speed digital design. Now, there’s a comprehensive and up-to-date guide to overcoming these challenges, direct from Dr. Mike Peng Li, cochair of the PCI Express jitter standard committee.
One of the field’s most respected experts, Li has brought together the latest theory, analysis, methods, and practical applications, demonstrating how to solve difficult JNB and SI problems in both link components and complete systems. Li introduces the fundamental terminology, definitions, and concepts associated with JNB and SI, as well as their sources and root causes. He guides readers from basic math, statistics, circuit and system models all the way through final applications. Emphasizing clock and serial data communications applications, he covers JNB and SI simulation, modeling, diagnostics, debugging, compliance testing, and much more.
This book brings together an international team of experts from the fields of materials science, nanotechnology and dentistry, to explain these new materials and their applications for the restoration, fixation, replacement, or regeneration of hard and soft tissues in and about the oral cavity and craniofacial region.
The main topics covered include applications in dental specialties (Orthodontics, Endodontics, Pediatric dentistry, Periodontics, Prosthodontics and Implant dentistry), salivary diagnostics using bioMEMS/NEMS systems, nanochips for oral cancer diagnosis, biomimetic nanomaterials, and nanotechnology for tooth repair and regeneration.
The editors' previous book, Emerging Nanotechnologies in Dentistry focused on the fabrication/manufacturing processes of materials and dentistry applications. This second book complements the first covers with coverage of the range of nanomaterials available today in clinical dentistry, explaining the innovative techniques and applications in all of the main clinical dental specialties.
Nanobiomaterial engineers, biomedical researchers, biomedical engineers and dental/oral pre-clinical and clinical researchers will find the comprehensive coverage essential for working with nanotechnologies and materials in both clinical and research settings.Book prepared by an interdisciplinary and international group of scientists and practitioners in the fields of nanomaterials, dental implants, medical devices and clinical practiceComprehensive professional reference for the subject covering materials fabrication and use of materials for all major diagnostic and therapeutic dental applications – repair, restoration, regeneration, implants and preventionComplements the editors' previous book on nanotechnology applications for dentistry
Recent advances show that many of the current problems with water quality can be addressed using nanosorbents, nanocatalysts, bioactive nanoparticles, nanostructured catalytic membranes, and nanoparticle enhanced filtration. The book describes these technologies in detail and demonstrates how they can provide clean drinking water in both large scale water treatment plants and in point-of-use systems. In addition, the book addresses the societal factors that may affect widespread acceptance of the applications.
Sections are also featured on carbon nanotube arrays and graphene-based sensors for contaminant sensing, nanostructured membranes for water purification, and multifunctional materials in carbon microspheres for the remediation of chlorinated hydrocarbons.Addresses both the technological aspects of delivering clean water supplies and the societal implications that affect take-upDetails how the technologies are applied in large-scale water treatment plants and in point-of-use systemsHighlights challenges and the opportunities for nanotechnology to positively influence this area of environmental protection
Nanoscience research is also characterized by rapid movement within disciplines. The amount of time it takes wading through papers and chasing down academics is frustrating and wasteful and our reviewers seem to suggest this work would give an excellent starting point for their work. The current source of published data is either in journal articles, which requires highly advanced knowledge of background information, or books on the subject, which can skim over the essential details of preparations. Having a cookbook to hand to flick through and from which you may select a preparation acts as a good source of contact both to researchers and those who supervise them alike.
This book therefore supports fundamental nanoscience experimentation. It is by intention much more user-friendly than traditional published works, which too-frequently assumes state of the art knowledge. Moreover you can pick up this book and find a synthesis to suit your needs without digging through specialist papers or tracking someone down who eventually may or may not be able to help. Once you have used the recipe the book would then act as a reference guide for how to analyze these materials and what to look out for.100+ detailed recipes for synthesis of basic nanostructured materials, enables readers to pick up the book and get started on a preparation immediately.High fidelity images show how preparations should look rather than vague schematics or verbal descriptions.Sequential and user-friendly by design, so the reader won't get lost in overly detailed theory or miss out a step from ignorance. A cookbook, by design and structure the work is easy to use, familiar and compact.
Because you're not writing programs--rather, you're designing a chip whose sole purpose is to do what you tell it--it's faster than anything you can do in code. With Make: FPGAs, you'll learn how to break down problems into something that can be solved on an FPGA, design the logic that will run on your FPGA, and hook up electronic components to create finished projects.
From the Reviews...
"This handbook will be a valuable resource for many academiclibraries. Many engineering librarians who work with a variety ofprograms (including, but not limited to Materials Engineering)should include this work in their collection. My recommendation isto add this work to any collection that serves a campus with amaterials/manufacturing/electrical/computer engineering programsand campuses with departments of physics and/or chemistry withlarge graduate-level enrollment."
—Randy Wallace, Department Head, Discovery ParkLibrary, University of North Texas
Following a short introduction to the working principles of laser diodes, the book describes the basics of laser diode beams and beam propagation, including Zemax modeling of a Gaussian beam propagating through a lens. The core of the book is concerned with laser diode beam manipulations: collimating and focusing, circularization and astigmatism correction, coupling into a single mode optical fiber, diffractive optics and beam shaping, and manipulation of multi transverse mode beams. The final chapter of the book covers beam characterization methods, describing the measurement of spatial and spectral properties, including wavelength and linewidth measurement techniques.
The book is a significantly revised and expanded version of the title Laser Diode Beam Basics, Manipulations and Characterizations by the same author. New topics introduced in this volume include: laser diode types and working principles, non-paraxial Gaussian beam, Zemax modeling, numerical analysis of a laser diode beam, spectral property characterization methods, and power and energy characterization techniques. The book approaches the subject in a practical way with mathematical content kept to the minimum level required, making the book a convenient reference for laser diode users.
This book provides an overview on the particular developmentsteps of gas insulated high-voltage switchgear, and is based on theinformation given with the editor’s tutorial. The theory iskept low only as much as it is needed to understand gas insulatedtechnology, with the main focus of the book being on deliveringpractical application knowledge. It discusses some introductory andadvanced aspects in the meaning of applications.
The start of the book presents the theory of Gas InsulatedTechnology, and outlines reliability, design, safety, grounding andbonding, and factors for choosing GIS. The third chapter presentsthe technology, covering the following in detail: manufacturing,specification, instrument transformers, Gas Insulated Bus, and theassembly process. Next, the book goes into control and monitoring,which covers local control cabinet, bay controller, controlschemes, and digital communication. Testing is explained in themiddle of the book before installation and energization.Importantly, operation and maintenance is discussed. This chapterincludes information on repair, extensions, retrofit or upgrade,and overloading. Finally applications are covered along withconcepts of layout, typical layouts, mixed technology substations,and then other topics such as life cycle assessment, environmentalimpact, and project management.A one-stop, complete reference text on gas insulatedsubstations (GIS), large-capacity and long-distance electricitytransmission, which are of increasing importance in the powerindustry todayDetails advanced and basic material, accessible for bothexisting GIS users and those planning to adopt the technologyDiscusses both the practical and theoretical aspects ofGISWritten by acknowledged GIS experts who have been involved inthe development of the technology from the start
* World-renowned author team address the hot-topic of nanotechnology
* The first book to address and explore the impacts and opportunities of nanotech for mainstream designers, engineers and architects
* Full colour production and excellent design: guaranteed to appeal to everyone concerned with good design and the use of new materials
Poly(Ethylene Terephthalate) Based Blends, Composites and Nanocompositesfills this gap and systematically guides the reader through all aspects of PET and its blends, composites and nanocomposites. It covers theoretical fundamentals, nanocomposites preparation, modification techniques, structure-property relationships, characterisation of the different blends and composites, and material choice for specific applications.
Consisting of contributions from experts in the field this book is a useful reference for the researchers and engineers working on the development and characterization of PET materials as well as on implementing them in real-world products. It can also be used as a standard reference for deeper insight in the mechanical, thermal, thermo-mechanical and visco-elastic aspects in product design decisions.Provides a systematic overview on all types of poly(ethylene) terephthalate (PET) based blends, composites and nanocompositesInforms about characterization, structure-property relationships and types of modificationsLinks material properties to specific applications, enabling engineers to make the best material choice to increase product performance and cost efficiency, in industries ranging from aerospace to energy
As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge.
Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy.
The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includesNew advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering
High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.
Divided into eight chapters, the topics covered include: Quantum Mechanics, Basics of Tunneling, The Tunnel FET, Drain current modelling of Tunnel FET: The task and its challenges, Modeling the Surface Potential in TFETs, Modelling the Drain Current, and Device simulation using Technology Computer Aided Design (TCAD). The information is well organized, describing different phenomena in the TFETs using simple and logical explanations.
* Enables readers to understand the basic concepts of TFET functioning and modelling in order to read, understand, and critically analyse current research on the topic with ease.
* Includes state-of-the-art work on TFETs, attempting to cover all the recent research articles published on the subject.
* Discusses the basic physics behind tunneling, as well as the device physics of the TFETs.
* Provides detailed discussion on device simulations along with device physics so as to enable researchers to carry forward their study on TFETs.
Primarily targeted at new and practicing researchers and post graduate students, the book would particularly be useful for researchers who are working in the area of compact and analytical modelling of semiconductor devices.
Real-world case studies are included, e.g. the discussion of a leading chemical company's unusual pairing with the USA's largest environmental NGO, and an innovative program designed for small- to mid-sized businesses, which became a model approach for proactive nanotechnology EHS risk management.Considers the potential of nanotechnology from multiple perspectives (NGO, insurance industry, small business, etc)Provides guidance and advice for appropriate, proactive risk management strategiesReviews toxicological studies and industrial initiatives, documented with actual case studiesOf significant interest to CEOs/CTOs of technology companies (SMEs), Health and Safety officers of technology companies (SMEs), Government officials (HSE), Toxicology experts, and venture capitalists
Part one looks at the properties of different ceramic nanocomposites, including thermal shock resistance, flame retardancy, magnetic and optical properties as well as failure mechanisms. Part two deals with the different types of ceramic nanocomposites, including the use of ceramic particles in metal matrix composites, carbon nanotube-reinforced glass-ceramic matrix composites, high temperature superconducting ceramic nanocomposites and ceramic particle nanofluids. Part three details the processing of nanocomposites, including the mechanochemical synthesis of metallic–ceramic composite powders, sintering of ultrafine and nanosized ceramic and metallic particles and the surface treatment of carbon nanotubes using plasma technology. Part four explores the applications of ceramic nanocomposites in such areas as energy production and the biomedical field.
With its distinguished editors and international team of expert contributors, Ceramic nanocomposites is a technical guide for professionals requiring knowledge of ceramic nanocomposites, and will also offer a deeper understanding of the subject for researchers and engineers within any field dealing with these materials.Reviews the structure and properties of ceramic nanocomposites as well as their manufacturing and applicationsExamines properties of different ceramic nanocomposites, as well as failure mechanismsDetails the processing of nanocomposites and explores the applications of ceramic nanocomposites in areas such as energy production and the biomedical field
Important new applications for this technology (such as windturbines, electric propulsion systems for large ships, etc.) areaddressed and the book is illustrated with a large number ofinformative and detailed photographs, provided by various companiesat the leading edge of research and applications in the field.
The multidisciplinary nature of this field – intersecting engineering, physics, chemistry, biology, microtechnology and biotechnology – means that the community of engineers and scientists now engaged in developing microfluidic devices has entered the field from a variety of different backgrounds.
Micromixers is uniquely comprehensive, in that it deals not only with the problems that are directly related to fluidics as a discipline (aspects such as mass transport, molecular diffusion, electrokinetic phenomena, flow instabilities, etc.) but also with the practical issues of fabricating micomixers and building them into microsystems and lab-on-chip assemblies.With practical applications to the design of systems vital in modern communications, medicine and industry this book has already established itself as a key reference in an emerging and important field.
The 2e includes coverage of a broader range of fabrication techniques, additional examples of fully realized devices for each type of micromixer and a substantially extended section on industrial applications, including recent and emerging applications.Introduces the design and applications of micromixers for a broad audience across chemical engineering, electronics and the life sciences, and applications as diverse as lab-on-a-chip, ink jet printing, pharmaceutical manufacturing and DNA analysis Helps engineers and scientists to unlock the potential of micromixers by explaining both the scientific (microfluidics) aspects and the engineering involved in building and using successful microscale systems and devices with micromixersThe author's applied approach combines experience-based discussion of the challenges and pitfalls of using micromixers, with proposals for how to overcome them