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Want to know how to use an electronic component? This first book of a three-volume set includes key information on electronics parts for your projects—complete with photographs, schematics, and diagrams. You’ll learn what each one does, how it works, why it’s useful, and what variants exist. No matter how much you know about electronics, you’ll find fascinating details you’ve never come across before.

Convenient, concise, well-organized, and precise

Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips—whether you’re refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.

Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumes Incredibly detailed: includes information distilled from hundreds of sources Easy to browse: parts are clearly organized by component type Authoritative: fact-checked by expert advisors to ensure that the information is both current and accurate Reliable: a more consistent source of information than online sources, product datasheets, and manufacturer’s tutorials Instructive: each component description provides details about substitutions, common problems, and workarounds Comprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
Want to know how to use an electronic component? This second book of a three-volume set includes key information on electronics parts for your projects--complete with photographs, schematics, and diagrams. You'll learn what each one does, how it works, why it's useful, and what variants exist. No matter how much you know about electronics, you'll find fascinating details you've never come across before.

Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips--whether you're refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.

Volume 2 covers signal processing, including LEDs, LCDs, audio, thyristors, digital logic, and amplification.

Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer's tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semiconductors; Volume 2 includes LEDs, LCDs, audio, thyristors, digital logic, and amplification; Volume 3 covers a range of sensing devices.
The #1 Practical Guide to Signal Integrity Design—Now Updated with Extensive New Coverage!

This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition’s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design—topics at the forefront of contemporary electronics design.

Coverage includes 
A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.

The Acclaimed RF Microelectronics Best-Seller, Expanded and Updated for the Newest Architectures, Circuits, and Devices

Wireless communication has become almost as ubiquitous as electricity, but RF design continues to challenge engineers and researchers. In the 15 years since the first edition of this classic text, the demand for higher performance has led to an explosive growth of RF design techniques. In RF Microelectronics, Second Edition, Behzad Razavi systematically teaches the fundamentals as well as the state-of-the-art developments in the analysis and design of RF circuits and transceivers.

Razavi has written the second edition to reflect today’s RF microelectronics, covering key topics in far greater detail. At nearly three times the length of the first edition, the second edition is an indispensable tome for both students and practicing engineers. With his lucid prose, Razavi now

Offers a stronger tutorial focus along with hundreds of examples and problems Teaches design as well as analysis with the aid of step-by-step design procedures and a chapter dedicated to the design of a dual-band WiFi transceiver Describes new design paradigms and analysis techniques for circuits such as low-noise amplifiers, mixers, oscillators, and frequency dividers

This edition’s extensive coverage includes brand new chapters on mixers, passive devices, integer-N synthesizers, and fractional-N synthesizers. Razavi’s teachings culminate in a new chapter that begins with WiFi’s radio specifications and, step by step, designs the transceiver at the transistor level.

Coverage includes

Core RF principles, including noise and nonlinearity, with ties to analog design, microwave theory, and communication systems An intuitive treatment of modulation theory and wireless standards from the standpoint of the RF IC designer Transceiver architectures such as heterodyne, sliding-IF, directconversion, image-reject, and low-IF topologies. Low-noise amplifiers, including cascode common-gate and commonsource topologies, noise-cancelling schemes, and reactance-cancelling configurations Passive and active mixers, including their gain and noise analysis and new mixer topologies Voltage-controlled oscillators, phase noise mechanisms, and various VCO topologies dealing with noisepower-tuning trade-offs All-new coverage of passive devices, such as integrated inductors, MOS varactors, and transformers A chapter on the analysis and design of phase-locked loops with emphasis on low phase noise and low spur levels Two chapters on integer-N and fractional-N synthesizers, including the design of frequency dividers Power amplifier principles and circuit topologies along with transmitter architectures, such as polar modulation and outphasing
 Rad-hard Semiconductor Memories is intended for researchers and professionals interested in understanding how to design and make a preliminary evaluation of rad-hard semiconductor memories, making leverage on standard CMOS manufacturing processes available from different silicon foundries and using different technology nodes. 


In the first part of the book, a preliminary overview of the effects of radiation in space, with a specific focus on memories, will be conducted to enable the reader to understand why specific design solutions are adopted to mitigate hard and soft errors. The second part will be devoted to RHBD (Radiation Hardening by Design) techniques for semiconductor components with a specific focus on memories. The approach will follow a top-down scheme starting from RHBD at architectural level (how to build a rad-hard floor-plan), at circuit level (how to mitigate radiation effects by handling transistors in the proper way) and at layout level (how to shape a layout to mitigate radiation effects). 

After the description of the mitigation techniques, the book enters in the core of the topic covering SRAMs (synchronous, asynchronous, single port and dual port) and PROMs (based on AntiFuse OTP technologies), describing how to design a rad-hard flash memory and fostering RHBD toward emerging memories like ReRAM. The last part will be a leap into emerging memories at a very early stage, not yet ready for industrial use in silicon but candidates to become an option for the next wave of rad-hard components. 

Technical topics discussed in the book include: 

Radiation effects on semiconductor components (TID, SEE)Radiation Hardening by Design (RHBD) TechniquesRad-hard SRAMsRad-hard PROMsRad-hard Flash NVMsRad-hard ReRAMsRad-hard emerging technologies
This book, Amplifiers: Analysis and Design, is the second of four books of a larger work, Fundamentals of Electronics. It is comprised of four chapters that describe the fundamentals of amplifier performance. Beginning with a review of two-port analysis, the first chapter introduces the modeling of the response of transistors to AC signals. Basic one-transistor amplifiers are extensively discussed. The next chapter expands the discussion to multiple transistor amplifiers. The coverage of simple amplifiers is concluded with a chapter that examines power amplifiers. This discussion defines the limits of small-signal analysis and explores the realm where these simplifying assumptions are no longer valid and distortion becomes present. The final chapter concludes the book with the first of two chapters in Fundamental of Electronics on the significant topic of feedback amplifiers. Fundamentals of Electronics has been designed primarily for use in an upper division course in electronics for electrical engineering students. Typically such a course spans a full academic years consisting of two semesters or three quarters. As such, Amplifiers: Analysis and Design, and two other books, Electronic Devices and Circuit Applications, and Active Filters and Amplifier Frequency Response, form an appropriate body of material for such a course. Secondary applications include the use with Electronic Devices and Circuit Applications in a one-semester electronics course for engineers or as a reference for practicing engineers.
This book, Electronic Devices and Circuit Application, is the first of four books of a larger work, Fundamentals of Electronics. It is comprised of four chapters describing the basic operation of each of the four fundamental building blocks of modern electronics: operational amplifiers, semiconductor diodes, bipolar junction transistors, and field effect transistors. Attention is focused on the reader obtaining a clear understanding of each of the devices when it is operated in equilibrium. Ideas fundamental to the study of electronic circuits are also developed in the book at a basic level to lessen the possibility of misunderstandings at a higher level. The difference between linear and non-linear operation is explored through the use of a variety of circuit examples including amplifiers constructed with operational amplifiers as the fundamental component and elementary digital logic gates constructed with various transistor types. Fundamentals of Electronics has been designed primarily for use in an upper division course in electronics for electrical engineering students. Typically such a course spans a full academic years consisting of two semesters or three quarters. As such, Electronic Devices and Circuit Applications, and the following two books, Amplifiers: Analysis and Design and Active Filters and Amplifier Frequency Response, form an appropriate body of material for such a course. Secondary applications include the use in a one-semester electronics course for engineers or as a reference for practicing engineers.
Foreword by Joungho Kim

The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts

In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability.

After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics.

Coverage includes

The exponentially growing challenge of I/O power integrity in high-speed digital systems PDN noise analysis and its timing impact for single-ended and differential interfaces Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity Time domain gauges for designing and optimizing components and systems Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects

Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.

Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results.

The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination.

The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others.

Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuitsReliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industriesCovers processes and equipment, as well as new materials and changes required for the surface conditioning process
Want to know how to use an electronic component? This third book of a three-volume set includes key information on electronics parts for your projects--complete with photographs, schematics, and diagrams. You'll learn what each one does, how it works, why it's useful, and what variants exist. No matter how much you know about electronics, you'll find fascinating details you've never come across before.

Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips--whether you're refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.

Volume 3 covers components for sensing the physical world, including light, sound, heat, motion, ambient, and electrical sensors.

Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer's tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
Everyone is familiar with the amazing performance of a modern smartphone, powered by a billion-plus nanotransistors, each having an active region that is barely a few hundred atoms long. The same amazing technology has also led to a deeper understanding of the nature of current flow and heat dissipation on an atomic scale which is of broad relevance to the general problems of non-equilibrium statistical mechanics that pervade many different fields.

This book is based on a set of two online courses originally offered in 2012 on nanoHUB-U and more recently in 2015 on edX. In preparing the second edition the author decided to split it into parts A and B titled Basic Concepts and Quantum Transport respectively, along the lines of the two courses. A list of available video lectures corresponding to different sections of this volume is provided upfront.

To make these lectures accessible to anyone in any branch of science or engineering, the author assume very little background beyond linear algebra and differential equations. However, the author will be discussing advanced concepts that should be of interest even to specialists, who are encouraged to look at his earlier books for additional technical details.



Contents: PrefaceAcknowledgmentsList of Available Video Lectures Quantum TransportConstants Used in This BookSome Symbols UsedOverviewContact-ing Schrödinger: The ModelNEGF MethodCan Two Offer Less Resistance than One?More on NEGF: Quantum of ConductanceInelastic ScatteringDoes NEGF Include "Everything?"Spin Transport: Rotating an ElectronQuantum to ClassicalEpilogue: Probabilistic Spin Logic (PSL)Appendices: List of Equations and Figures Cited From Part ANEGF EquationsMATLAB Codes Used for d104 FiguresTable of Contents of Part A: Basic ConceptsAvailable Video Lectures for Part A: Basic Concepts
Readership: Students and professionals in any branch of science or engineering.
Keywords: Nanoelectronics;Transport;Theory;Spintronics;Thermoelectricity;Entropy;NanotransistorReview: Key Features: Based on a physically insightful approach that not only conveys the key concepts of nanoelectronics, but also their relevance to other non-equilibrium problems like heat flow, spin flow and entropy flowThe chapters are keyed to video lectures from the online courses offered on nanoHUB-U and on edXThe author received the 2008 IEEE Technical Field Award for graduate teaching "for his unique approach to quantum transport that has inspired and educated graduate students in the field of nanoscale electronic devices"
Computational electrodynamics is a vast research field with a wide variety of tools. In physics, the principle of gauge invariance plays a pivotal role as a guide towards a sensible formulation of the laws of nature as well as for computing the properties of elementary particles using the lattice formulation of gauge theories. However, the gauge principle has played a much less pronounced role in performing computation in classical electrodynamics.

In this work, the author demonstrates that starting from the gauge formulation of electrodynamics using the electromagnetic potentials leads to computational tools that can very well compete with the conventional electromagnetic field-based tools. Once accepting the formulation based on gauge fields, the computational code is very transparent due to the mimetic mapping of the electrodynamic variables on the computational grid. Although the illustrations and applications originate from microelectronic engineering, the method has a much larger range of applicability. Therefore this book will be useful to everyone having interest in computational electrodynamics.

The volume is organized as follows: In part 1, a detailed introduction and overview is presented of the Maxwell equations as well as the derivation of the current and charge densities in different materials. Semiconductors are responding to electromagnetic fields in a non-linear way, and the induced complications are discussed in detail. Part 2, using the gauge potentials, presents the transition of electrodynamics theory to a formulation that can serve as the gateway to computational code. In part 3, a collection of microelectronic device designs demonstrate the feasibility and success of the methods in Part 2. Part 4 focuses on a set of topical themes that brings the reader to the frontier of research in building the simulation tools, using the gauge principle in computational electrodynamics.

Technical topics discussed in the book include:
- Electromagnetic Field Equations
- Constitutive Relations
- Discretization and Numerical Analysis
- Finite Element and Finite Volume Methods
- Design of Integrated Passive Components
This is the enhanced eBook version of the printed book. It contains 1 hour and 48 minutes of video conversations and circuit animations from the industry's leading circuit design engineer, Doug Brooks.

 

Today, PCB designers must deal with issues such as crosstalk and EMI–issues that were once associated only with components. This requires electronics knowledge that many PCB designers never gain through formal training. In PCB Currents, renowned PCB designer Douglas Brooks teaches these essentials descriptively, in plain English, with as little reliance on mathematics as possible.

Building on his widely praised seminars, Brooks explains what current is, how it flows, and how it reacts. He begins by reviewing the nature of current, and then explains current flow in basic circuits, discusses sources that supply and drive current, and addresses the unique problems associated with current on PCBs.

Brooks concludes by thoroughly illuminating signal integrity issues caused by current flow. He offers practical design solutions for each common type of problem, as well as for complex challenges involving very high frequency harmonics and very short wavelengths.

The text is written to be accessible and valuable for PCB designers at all levels of experience, whether they have engineering training or not.

 

Finally, in this Enhanced eBook Edition, some videos and animations have been incorporated as an additional benefit. They fall into four categories.

 

First, there is an introductory video at the beginning of the Preface. It is intended to help put the entire book into a perspective.

 

Second, each section has an introductory video that outlines what is contained within that section and, in most cases, the most important points to be discovered in that section.

 

Third, each chapter has its own, short introduction, again highlighting the most important points within the chapter.

 

Finally, in Chapters 17 and 18, we have some animation videos to help explain some dynamic interactions. It is hard to envision what is happening when a signal reflects off the far end of a trace, or when a signal couples into an adjacent trace (crosstalk) as it travels along using just static figures. But an animation video makes these phenomena much easier to understand.

 

These videos are an important benefit available to you, the ebook reader, and one that cannot be incorporated into a print edition.

 

A comprehensive introduction and up-to-date reference to SiC power semiconductor devices covering topics from material properties to applications

Based on a number of breakthroughs in SiC material science and fabrication technology in the 1980s and 1990s, the first SiC Schottky barrier diodes (SBDs) were released as commercial products in 2001. The SiC SBD market has grown significantly since that time, and SBDs are now used in a variety of power systems, particularly switch-mode power supplies and motor controls. SiC power MOSFETs entered commercial production in 2011, providing rugged, high-efficiency switches for high-frequency power systems. In this wide-ranging book, the authors draw on their considerable experience to present both an introduction to SiC materials, devices, and applications and an in-depth reference for scientists and engineers working in this fast-moving field. Fundamentals of Silicon Carbide Technology covers basic properties of SiC materials, processing technology, theory and analysis of practical devices, and an overview of the most important systems applications. Specifically included are: A complete discussion of SiC material properties, bulk crystal growth, epitaxial growth, device fabrication technology, and characterization techniques. Device physics and operating equations for Schottky diodes, pin diodes, JBS/MPS diodes, JFETs, MOSFETs, BJTs, IGBTs, and thyristors. A survey of power electronics applications, including switch-mode power supplies, motor drives, power converters for electric vehicles, and converters for renewable energy sources. Coverage of special applications, including microwave devices, high-temperature electronics, and rugged sensors. Fully illustrated throughout, the text is written by recognized experts with over 45 years of combined experience in SiC research and development.

This book is intended for graduate students and researchers in crystal growth, material science, and semiconductor device technology. The book is also useful for design engineers, application engineers, and product managers in areas such as power supplies, converter and inverter design, electric vehicle technology, high-temperature electronics, sensors, and smart grid technology.

Interest in latchup is being renewed with the evolution of complimentary metal-oxide semiconductor (CMOS) technology, metal-oxide-semiconductor field-effect transistor (MOSFET) scaling, and high-level system-on-chip (SOC) integration.

Clear methodologies that grant protection from latchup, with insight into the physics, technology and circuit issues involved, are in increasing demand.

This book describes CMOS and BiCMOS semiconductor technology and their sensitivity to present day latchup phenomena, from basic over-voltage and over-current conditions, single event latchup (SEL) and cable discharge events (CDE), to latchup domino phenomena. It contains chapters focusing on bipolar physics, latchup theory, latchup and guard ring characterization structures, characterization testing, product level test systems, product level testing and experimental results. Discussions on state-of-the-art semiconductor processes, design layout, and circuit level and system level latchup solutions are also included, as well as:

latchup semiconductor process solutions for both CMOS to BiCMOS, such as shallow trench, deep trench, retrograde wells, connecting implants, sub-collectors, heavily-doped buried layers, and buried grids – from single- to triple-well CMOS; practical latchup design methods, automated and bench-level latchup testing methods and techniques, latchup theory of logarithm resistance space, generalized alpha (a) space, beta (b) space, new latchup design methods– connecting the theoretical to the practical analysis, and; examples of latchup computer aided design (CAD) methodologies, from design rule checking (DRC) and logical-to-physical design, to new latchup CAD methodologies that address latchup for internal and external latchup on a local as well as global design level.

Latchup acts as a companion text to the author’s series of books on ESD (electrostatic discharge) protection, serving as an invaluable reference for the professional semiconductor chip and system-level ESD engineer. Semiconductor device, process and circuit designers, and quality, reliability and failure analysis engineers will find it informative on the issues that confront modern CMOS technology. Practitioners in the automotive and aerospace industries will also find it useful. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, computer aided design and design integration.

New nanomaterials are leading to a range of emerging dental treatments that utilize more biomimetic materials that more closely duplicate natural tooth structure (or bone, in the case of implants).

This book brings together an international team of experts from the fields of materials science, nanotechnology and dentistry, to explain these new materials and their applications for the restoration, fixation, replacement, or regeneration of hard and soft tissues in and about the oral cavity and craniofacial region.

The main topics covered include applications in dental specialties (Orthodontics, Endodontics, Pediatric dentistry, Periodontics, Prosthodontics and Implant dentistry), salivary diagnostics using bioMEMS/NEMS systems, nanochips for oral cancer diagnosis, biomimetic nanomaterials, and nanotechnology for tooth repair and regeneration.

The editors' previous book, Emerging Nanotechnologies in Dentistry focused on the fabrication/manufacturing processes of materials and dentistry applications. This second book complements the first covers with coverage of the range of nanomaterials available today in clinical dentistry, explaining the innovative techniques and applications in all of the main clinical dental specialties.

Nanobiomaterial engineers, biomedical researchers, biomedical engineers and dental/oral pre-clinical and clinical researchers will find the comprehensive coverage essential for working with nanotechnologies and materials in both clinical and research settings.

Book prepared by an interdisciplinary and international group of scientists and practitioners in the fields of nanomaterials, dental implants, medical devices and clinical practiceComprehensive professional reference for the subject covering materials fabrication and use of materials for all major diagnostic and therapeutic dental applications – repair, restoration, regeneration, implants and preventionComplements the editors' previous book on nanotechnology applications for dentistry
This study is a theoretical investigation of the electronic and optical properties of intrinsic semiconductors using the orthogonal empirical tight binding model. An analysis of the bulk properties of semiconductors with the zincblende, diamond and rocksalt structures has been carried out. We have extended the work of others to higher order in the interaction integrals and derived new parameter sets for certain semiconductors which better fit the experimental data over the Brillouin zone. The Hamiltonian of the heterostructures is built up layer by layer from the parameters of the bulk constituents. The second part of this work examines a number of applications of the theory. We present a new microscopic derivation of the intervalley deformation potentials within the tight binding representation and computes a number of conduction-band deformation potentials of bulk semiconductors. We have also studied the electronic states in heterostructures and have shown theoretically the possibility of having barrier localization of above-barrier states in a multivalley heterostructure using a multiband calculation. Another result is the proposal for a new "type-II" lasing mechanism in short-period GaAs/AlAs superlattices. As for our work on the optical properties, a new formalism, based on the generalized Feynman-Hellmann theorem, for computing interband optical matrix elements has been obtained and has been used to compute the linear and second-order nonlinear optical properties of a number of bulk semiconductors and semiconductor heterostructures. In agreement with the one-band elective mass calculations of other groups, our more elaborate calculations show that the intersubband oscillator strengths of quantum wells can be greatly enhanced over the bulk interband values.
Nanotechnology is already having a dramatic impact on improving water quality and the second edition of Nanotechnology Applications for Clean Water highlights both the challenges and the opportunities for nanotechnology to positively influence this area of environmental protection. This book presents detailed information on cutting-edge technologies, current research, and trends that may impact the success and uptake of the applications.

Recent advances show that many of the current problems with water quality can be addressed using nanosorbents, nanocatalysts, bioactive nanoparticles, nanostructured catalytic membranes, and nanoparticle enhanced filtration. The book describes these technologies in detail and demonstrates how they can provide clean drinking water in both large scale water treatment plants and in point-of-use systems. In addition, the book addresses the societal factors that may affect widespread acceptance of the applications.

Sections are also featured on carbon nanotube arrays and graphene-based sensors for contaminant sensing, nanostructured membranes for water purification, and multifunctional materials in carbon microspheres for the remediation of chlorinated hydrocarbons.

Addresses both the technological aspects of delivering clean water supplies and the societal implications that affect take-upDetails how the technologies are applied in large-scale water treatment plants and in point-of-use systemsHighlights challenges and the opportunities for nanotechnology to positively influence this area of environmental protection
The peculiarities of materials at the nanoscale demand an interdisciplinary approach which can be difficult for students and researchers who are trained predominantly in a single field. A chemist might not have experience at working with cell cultures or a physicist may have no idea how to make the gold colloid they need for calibrating an atomic force microscope. The interdisciplinary approach of the book will help you to quickly synthesize information from multiple perspectives.

Nanoscience research is also characterized by rapid movement within disciplines. The amount of time it takes wading through papers and chasing down academics is frustrating and wasteful and our reviewers seem to suggest this work would give an excellent starting point for their work. The current source of published data is either in journal articles, which requires highly advanced knowledge of background information, or books on the subject, which can skim over the essential details of preparations. Having a cookbook to hand to flick through and from which you may select a preparation acts as a good source of contact both to researchers and those who supervise them alike.

This book therefore supports fundamental nanoscience experimentation. It is by intention much more user-friendly than traditional published works, which too-frequently assumes state of the art knowledge. Moreover you can pick up this book and find a synthesis to suit your needs without digging through specialist papers or tracking someone down who eventually may or may not be able to help. Once you have used the recipe the book would then act as a reference guide for how to analyze these materials and what to look out for.

100+ detailed recipes for synthesis of basic nanostructured materials, enables readers to pick up the book and get started on a preparation immediately.High fidelity images show how preparations should look rather than vague schematics or verbal descriptions.Sequential and user-friendly by design, so the reader won't get lost in overly detailed theory or miss out a step from ignorance. A cookbook, by design and structure the work is easy to use, familiar and compact.
This book offers the reader a practical guide to the control and characterization of laser diode beams. Laser diodes are the most widely used lasers, accounting for 50% of the global laser market. Correct handling of laser diode beams is the key to the successful use of laser diodes, and this requires an in-depth understanding of their unique properties.

Following a short introduction to the working principles of laser diodes, the book describes the basics of laser diode beams and beam propagation, including Zemax modeling of a Gaussian beam propagating through a lens. The core of the book is concerned with laser diode beam manipulations: collimating and focusing, circularization and astigmatism correction, coupling into a single mode optical fiber, diffractive optics and beam shaping, and manipulation of multi transverse mode beams. The final chapter of the book covers beam characterization methods, describing the measurement of spatial and spectral properties, including wavelength and linewidth measurement techniques.

The book is a significantly revised and expanded version of the title Laser Diode Beam Basics, Manipulations and Characterizations by the same author. New topics introduced in this volume include: laser diode types and working principles, non-paraxial Gaussian beam, Zemax modeling, numerical analysis of a laser diode beam, spectral property characterization methods, and power and energy characterization techniques. The book approaches the subject in a practical way with mathematical content kept to the minimum level required, making the book a convenient reference for laser diode users.

The Surface Mount Technology columns, the “Step Series,” are a mainstay in the semiconductor industry. Written by prominent industry leaders, each column from the 2005 year and published in SMT, addresses a critical 'step' in the manufacturing process, from the initial design stages through final rework. This technology driven series represents the most advanced research and creative solutions for the one of the most complex and capital intense industries in the world economy. In addition to the step series, SMT also includes its lead-free series of columns published in 2005. As the world prepares for lead-free manufacturing and the enactment of the Restrictions on Hazardous Materials directive, massive changes are happening for the surface mount assembly sector. The inclusion of these articles represents a year's worth of counsel, technology and research at a critical time for the industry. Key features include: --Best practices and innovative ideas for surface mount assemblers --How to guidelines in the conversion to lead-free manufacturing --Insight into the new WEEE and RoHS directives --Guest essay by longetime SMT columnist Rob Rowland on the state of the industry. The Surface Mount Technology columns, the “Step Series,” are a mainstay in the semiconductor industry. Written by prominent industry leaders, each column from the 2005 year and published in SMT, addresses a critical 'step' in the manufacturing process, from the initial design stages through final rework. This technology driven series represents the most advanced research and creative solutions for the one of the most complex and capital intense industries in the world economy. In addition to the step series, SMT also includes its lead-free series of columns published in 2005. As the world prepares for lead-free manufacturing and the enactment of the Restrictions on Hazardous Materials directive, massive changes are happening for the surface mount assembly sector. The inclusion of these articles represents a year's worth of counsel, technology and research at a critical time for the industry. Key features include: --Best practices and innovative ideas for surface mount assemblers --How to guidelines in the conversion to lead-free manufacturing --Insight into the new WEEE and RoHS directives --Guest essay by longetime SMT columnist Rob Rowland on the state of the industry.
Consistently Design PDNs That Deliver Reliable Performance at the Right Cost

Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries.

Coverage includes
• A practical, start-to-finish approach to consistently meeting PDN performance goals
• Understanding how signals interact with interconnects
• Identifying root causes of common problems, so you can avoid them
• Leveraging analysis tools to efficiently explore design space and optimize tradeoffs
• Analyzing impedance-related properties of series and parallel RLC circuits
• Measuring low impedance for components and entire PDN ecologies
• Predicting loop inductance from physical design features
• Reducing peak impedances from combinations of capacitors
• Understanding power and ground plane properties in the PDN interconnect
• Taming signal integrity problems when signals change return planes
• Reducing peak impedance created by on-die capacitance and package lead inductance
• Controlling transient current waveform interactions with PDN features
• Simple spreadsheet-based analysis techniques for quickly creating first-pass designs

This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.
Comprehensive reference covering all aspects of gas insulated substations including basic principles, technology, use & application, design, specification, testing and ownership issues

This book provides an overview on the particular development steps of gas insulated high-voltage switchgear, and is based on the information given with the editor’s tutorial. The theory is kept low only as much as it is needed to understand gas insulated technology, with the main focus of the book being on delivering practical application knowledge. It discusses some introductory and advanced aspects in the meaning of applications.

The start of the book presents the theory of Gas Insulated Technology, and outlines reliability, design, safety, grounding and bonding, and factors for choosing GIS. The third chapter presents the technology, covering the following in detail: manufacturing, specification, instrument transformers, Gas Insulated Bus, and the assembly process. Next, the book goes into control and monitoring, which covers local control cabinet, bay controller, control schemes, and digital communication. Testing is explained in the middle of the book before installation and energization. Importantly, operation and maintenance is discussed. This chapter includes information on repair, extensions, retrofit or upgrade, and overloading. Finally applications are covered along with concepts of layout, typical layouts, mixed technology substations, and then other topics such as life cycle assessment, environmental impact, and project management.

A one-stop, complete reference text on gas insulated substations (GIS), large-capacity and long-distance electricity transmission, which are of increasing importance in the power industry today Details advanced and basic material, accessible for both existing GIS users and those planning to adopt the technology Discusses both the practical and theoretical aspects of GIS Written by acknowledged GIS experts who have been involved in the development of the technology from the start
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling

Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.

Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.

The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.

The authors

Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures

This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

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