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因應5G、電動車時代來臨，對於高頻、高壓功率元件需求大增，帶動氮化鎵（GaN）、碳化矽（SiC）等寬能隙半導體材料興起，日前全球晶圓代工龍頭台積電宣布與意法半導體合作開發GaN，瞄準未來電動車之應用。
目前國際大廠包括英飛凌、Navitas、GaN Systems、Transphorm等均積極部署GaN，國內除了台積電之外，世界先進、嘉晶、漢磊、茂矽等也投入發展，相關商機備受期待。
本期2080期的《先探投資週刊》將探討氮化鎵這個台積電繼續稱霸全球的新戰場。
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