"A fabulous book: well written, well paced, fun, and informative. I also love the sense of humor. It's very good at disarming the fear. And it's gorgeous. I'll be recommending this book highly."
--Tom Igoe, author of Physical Computing and Making Things Talk
Want to learn the fundamentals of electronics in a fun, hands-on way? With Make: Electronics, you'll start working on real projects as soon as you crack open the book. Explore all of the key components and essential principles through a series of fascinating experiments. You'll build the circuits first, then learn the theory behind them!
Build working devices, from simple to complex You'll start with the basics and then move on to more complicated projects. Go from switching circuits to integrated circuits, and from simple alarms to programmable microcontrollers. Step-by-step instructions and more than 500 full-color photographs and illustrations will help you use -- and understand -- electronics concepts and techniques.Discover by breaking things: experiment with components and learn from failure Set up a tricked-out project space: make a work area at home, equipped with the tools and parts you'll need Learn about key electronic components and their functions within a circuit Create an intrusion alarm, holiday lights, wearable electronic jewelry, audio processors, a reflex tester, and a combination lock Build an autonomous robot cart that can sense its environment and avoid obstacles Get clear, easy-to-understand explanations of what you're doing and why
Navigate the roadmaps of simple electronic circuits and complex systems with help from an experienced engineer. With all-new art and demo circuits you can build, this hands-on, illustrated guide explains how to understand and create high-precision electronics diagrams. Find out how to identify parts and connections, decipher element ratings, and apply diagram-based information in your own projects. Beginner’s Guide to Reading Schematics, Third Edition, also contains valuable appendices covering symbols and resistor color codes.
Featuring detailed coverage of:Schematic, block, and pictorial diagrams Resistors and capacitors Inductors and transformers Switches, conductors, and cables Diodes, transistors, and logic gates Electron tubes Cells and batteries Voltage dividers and reducers Breadboards and wire wrapping Electronics troubleshooting
This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.
Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:
* Chip (wafer) level interconnects with lead-free solder bumps
* Lead-free solder wafer bumping with micro-ball mounting and paste printing methods
* Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates
* Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs
* Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate
* Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages
* Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging
* Environmental issues for conventional PCBs and substrates
* Some environmentally conscious flame-retardants for PCBs and organic substrates
* Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety
* Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives
* Criteria, development approaches, and varieties of alloys and properties of lead-free solders
* Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders
* Manufacturing process and performance of lead-free surface finishes for both PCB and component applications
* Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process
* Fundamental understanding of electrically conductive adhesive (ECA) technology
* Effects of lubricant removal and cure shrinkage on ECAs
* Mechanisms underlying the contact resistance shifts of ECAs
* Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs
* Stabilization of contact resistance of ECAs using various additives