The worldwide multi-facetted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in these many different sources, so it becomes essential to have most of the relevant and currently available information presented in a single publication. With this goal in mind the important issues encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas were invited to write articles on those topics. They were asked to address the importance of a given issue, the current status of understanding and available solutions, the problems that still need to be tackled and suggestions for potential approaches to do so.
The chapters are organized around the following subject areas: themodynamics and phase diagrams, solder developments, processing issues, mechanical property considerations, effects of thermal excursions (TMF), electromigraion, whisker growth, tin pest, and industrial perspectives (consumer electronics, and high-end high reliability applications).
This material originally appeared in a special issue of Journal of Materials Science: Materials in Electronics. Because this journal may not be a regular source of scientific information for academic researchers in fields other than Materials Science and those in industry, and to provide wider awareness of the current status of lead-free electronic solders to those persons active in the area but who are not regular readers of the Journal, these articles are being reprinted in book form.
Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.
Provides engineers the cutting-edge technology in a rapidly changing field
Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
The authors discuss the generation of table of contents, extraction of highlights, different techniques for audio and video marker recognition, and indexing with low-level features such as color, texture, and shape. Current applications including this summarization and browsing technology are also reviewed. Applications such as event detection in elevator surveillance, highlight extraction from sports video, and image and video database management are considered within the proposed framework. This book presents the latest in research and readers will find their search for knowledge completely satisfied by the breadth of the information covered in this volume.
* Offers the latest in cutting edge research and applications in surveillance and consumer video
* Presentation of a novel unified framework aimed at successfully sifting through the abundance of footage gathered daily at shopping malls, airports, and other commercial facilities
* Concisely written by leading contributors in the signal processing industry with step-by-step instruction in building video ToC and indices