Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

CRC Press
1
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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
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About the author

Puttlitz is Senior Member of the Technical Staff and Program Manager for Corporate Lead Reduction at IBM's East Fishkill Facility.

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Additional Information

Publisher
CRC Press
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Published on
Feb 27, 2004
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Pages
1048
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ISBN
9780203021484
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Best For
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Language
English
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Genres
Technology & Engineering / Electronics / General
Technology & Engineering / Electronics / Microelectronics
Technology & Engineering / Materials Science / General
Technology & Engineering / Metallurgy
Technology & Engineering / Microwaves
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Content Protection
This content is DRM protected.
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Eligible for Family Library

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This third edition includes more real-world examples and a glossary of formulae. It contains new coverage of:

MicrocontrollersFPGAsClasses of componentsMemory (RAM, ROM, etc.)Surface mountHigh speed designBoard layoutAdvanced digital electronics (e.g. processors)Transistor circuits and circuit designOp-amp and logic circuitsUse of test equipmentGives readers a simple explanation of complex concepts, in terms they can understand and relate to everyday life. Updated content throughout and new material on the latest technological advances.Provides readers with an invaluable set of tools and references that they can use in their everyday work.
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