The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts
In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability.
After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics.
Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.
Vishram S. Pandit is a technical lead in the Signal/Power Integrity Engineering team at Intel Corporation. He works on developing power delivery designs for high-speed interfaces. His focus areas include high-speed system power delivery, on-chip power delivery, and Signal/ Power Integrity co-design. Prior to Intel he worked at Hughes Network Systems on Electromagnetic Interference (EMI), Electromagnetic Compatibility (EMC), power integrity, and signal integrity technologies. He has received a B.E. (Instrumentation) from College of Engineering, Pune, India, an M.S. (Electrical Engineering) from University of Utah, USA, and an Advanced Certificate for Post-Master’s Study (Computer Science) from Johns Hopkins University, USA. He is a senior member of IEEE and a member of the CPMT Technical Committee on Electrical Design, Modeling and Simulation; and he serves as a technical program committee member for DesignCon. He was a recipient of the International Engineering Consortium’s paper awards for DesignCon 2008 and DesignCon 2009.
Woong Hwan Ryu is currently a Signal/Power Integrity Engineering Manager at Intel Corporation. He has been responsible for pre-silicon signal integrity and power integrity analysis for high speed interfaces. He received his Ph.D. degree in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST). Dr. Ryu holds an IEEE Senior Member status; he serves as a reviewer for several IEEE journals; and he serves as a technical program committee member and organizing committee member for DesignCon. He was a recipient of the International Engineering Consortium’s paper awards for DesignCon 2006 and DesignCon 2008. Dr. Ryu has authored and co-authored more than 80 technical publications in premier journals and international conferences, and holds three issued patents and has one patent pending.
Myoung Joon Choi is a technical lead in the Signal/Power Integrity Engineering team at Intel Corporation. He works on developing methodologies for high-speed interface simulation and analysis. His focus areas include high-speed system SI-PI co-simulation, on-chip signal and power integrity, and computational analysis of entire high-speed systems. Dr. Choi has received a Ph.D. and an M.S. from University of Illinois at Urbana-Champaign, Urbana, IL, USA, and a BS from Korea University, Seoul, Korea. He has authored and co-authored many technical publications in journals and conferences.
From the Reviews...
"This handbook will be a valuable resource for many academic libraries. Many engineering librarians who work with a variety of programs (including, but not limited to Materials Engineering) should include this work in their collection. My recommendation is to add this work to any collection that serves a campus with a materials/manufacturing/electrical/computer engineering programs and campuses with departments of physics and/or chemistry with large graduate-level enrollment."
—Randy Wallace, Department Head, Discovery Park Library, University of North Texas
The objective of EEIC 2011 Volume 1 is to provide a major interdisciplinary forum for the presentation of new approaches from Electronics and Signal Processing, to foster integration of the latest developments in scientific research. 133 related topic papers were selected into this volume. All the papers were reviewed by 2 program committee members and selected by the volume editor Prof. Wensong Hu.
We hope every participant can have a good opportunity to exchange their research ideas and results and to discuss the state of the art in the areas of the Electronics and Signal Processing.
Convenient, concise, well-organized, and precise
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips—whether you’re refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumes Incredibly detailed: includes information distilled from hundreds of sources Easy to browse: parts are clearly organized by component type Authoritative: fact-checked by expert advisors to ensure that the information is both current and accurate Reliable: a more consistent source of information than online sources, product datasheets, and manufacturer’s tutorials Instructive: each component description provides details about substitutions, common problems, and workarounds Comprehensive: Volume 1 covers power, electromagnetism, and discrete semi-conductors; Volume 2 includes integrated circuits, and light and sound sources; Volume 3 covers a range of sensing devices.
Perfect for teachers, hobbyists, engineers, and students of all ages, this reference puts reliable, fact-checked information right at your fingertips--whether you're refreshing your memory or exploring a component for the first time. Beginners will quickly grasp important concepts, and more experienced users will find the specific details their projects require.
Volume 2 covers signal processing, including LEDs, LCDs, audio, thyristors, digital logic, and amplification.Unique: the first and only encyclopedia set on electronic components, distilled into three separate volumesIncredibly detailed: includes information distilled from hundreds of sourcesEasy to browse: parts are clearly organized by component typeAuthoritative: fact-checked by expert advisors to ensure that the information is both current and accurateReliable: a more consistent source of information than online sources, product datasheets, and manufacturer's tutorialsInstructive: each component description provides details about substitutions, common problems, and workaroundsComprehensive: Volume 1 covers power, electromagnetism, and discrete semiconductors; Volume 2 includes LEDs, LCDs, audio, thyristors, digital logic, and amplification; Volume 3 covers a range of sensing devices.
This classic book has set the standard for advanced study and reference in the semiconductor device field. Now completely updated and reorganized to reflect the tremendous advances in device concepts and performance, this Third Edition remains the most detailed and exhaustive single source of information on the most important semiconductor devices. It gives readers immediate access to detailed descriptions of the underlying physics and performance characteristics of all major bipolar, field-effect, microwave, photonic, and sensor devices.
Designed for graduate textbook adoptions and reference needs, this new edition includes:A complete update of the latest developments New devices such as three-dimensional MOSFETs, MODFETs, resonant-tunneling diodes, semiconductor sensors, quantum-cascade lasers, single-electron transistors, real-space transfer devices, and more Materials completely reorganized Problem sets at the end of each chapter All figures reproduced at the highest quality
Physics of Semiconductor Devices, Third Edition offers engineers, research scientists, faculty, and students a practical basis for understanding the most important devices in use today and for evaluating future device performance and limitations.
A Solutions Manual is available from the editorial department.