Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Springer Science & Business Media
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
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Additional Information

Publisher
Springer Science & Business Media
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Published on
Feb 15, 2012
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Pages
594
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ISBN
9781461410539
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Features
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Best For
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Language
English
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Genres
Science / Chemistry / Analytic
Science / Physics / Condensed Matter
Science / Spectroscopy & Spectrum Analysis
Technology & Engineering / Electrical
Technology & Engineering / Electronics / Circuits / General
Technology & Engineering / Electronics / General
Technology & Engineering / Machinery
Technology & Engineering / Power Resources / General
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Content Protection
This content is DRM protected.
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