Advanced Piezoelectric Materials: Science and Technology

Elsevier
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Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications.

After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress.

With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering.
  • Provides a comprehensive review of the new materials, their properties and methods of manufacture and application
  • Explores the development of piezoelectric materials from the historical background to the present status
  • Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations
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About the author

Dr Kenji Uchino is a pioneer in piezoelectric actuators, Professor of Electrical Engineering at Penn State University, and Director of the International Center for Actuators and Transducers. He is also the founder and Senior VP & CTO of Micromechatronics, Inc. He has authored 277 papers, 54 books and 26 patents.

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Additional Information

Publisher
Elsevier
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Published on
Sep 27, 2010
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Pages
696
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ISBN
9781845699758
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Language
English
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Genres
Technology & Engineering / Electronics / Digital
Technology & Engineering / Electronics / General
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Content Protection
This content is DRM protected.
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Available on Android devices
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Eligible for Family Library

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The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them.
Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments.
High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts.
Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.

The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.

The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.

As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as:

• Tamper-proof adhesives for electronic security devices.

• Bio-compatible adhesives for implantable medical devices.

• Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market).

• Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionalsProvides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic deviceDiscusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.

The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.

With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applicationsProvides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systemsFocuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Updating its bestselling predecessor, Ferroelectric Devices, Second Edition assesses the last decade of developments—and setbacks—in the commercialization of ferroelectricity. Field pioneer and esteemed author Uchino provides insight into why this relatively nascent and interdisciplinary process has failed so far without a systematic accumulation of fundamental knowledge regarding materials and device development.

Filling the informational void, this collection of information reviews state-of-the-art research and development trends reflecting nano and optical technologies, environmental regulation, and alternative energy sources. Like the first edition, which became a standard in the field, this volume provides a general introduction to ferroelectrics with theoretical background. It then addresses practical design and device manufacturing, including recently developed processes and applications. Updating old data with a forecast of future developments, the text analyzes improvements to original ferroelectric devices to aid the design process of new ones.

The second edition includes new sections on:

Pb-free piezoelectrics

Size effect on ferroelectricity

Electrocaloric devices

Micro mass sensor

Piezoelectric energy harvesting

Light valves and scanners

Multi-ferroic devices, including magneto-electric sensors

Uchino provides a general introduction to the theoretical background of ferroelectric devices, practical materials, device designs, drive/control techniques, and typical applications. He presents frequently asked questions from students, lab demonstrations for practical understanding, and "check point" quizzes and model solutions to monitor understanding.

After a thorough exploration of ferroelectric devices and their past, this book looks to the industry’s future, assessing market size and remaining reliability/lifetime issues. The author also unveils his strategy for developing "best-selling" ferroelectric devices.

This comprehensive book covers recent developments in advanced dielectric, piezoelectric and ferroelectric materials. Dielectric materials such as ceramics are used to manufacture microelectronic devices. Piezoelectric components have been used for many years in radioelectrics, time-keeping and, more recently, in microprocessor-based devices. Ferroelectric materials are widely used in various devices such as piezoelectric/electrostrictive transducers and actuators, pyroelectric infrared detectors, optical integrated circuits, optical data storage and display devices.

The book is divided into eight parts under the general headings: High strain high performance piezo- and ferroelectric single crystals; Electric field-induced effects and domain engineering; Morphotropic phase boundary related phenomena; High power piezoelectric and microwave dielectric materials; Nanoscale piezo- and ferroelectrics; Piezo- and ferroelectric films; Novel processing and new materials; Novel properties of ferroelectrics and related materials. Each chapter looks at key recent research on these materials, their properties and potential applications.

Advanced dielectric, piezoelectric and ferroelectric materials is an important reference tool for all those working in the area of electrical and electronic materials in general and dielectrics, piezoelectrics and ferroelectrics in particular.Covers the latest developments in advanced dielectric, piezoelectric and ferroelectric materialsIncludes topics such as high strain high performance piezo and ferroelectric single crystalsDiscusses novel processing and new materials, and novel properties of ferroelectrics and related materials
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