APEX EXPO 2026 and the Advanced Electronic Packaging Conference: Component-to System-Level Integration is North America’s largest event for electronics manufacturing, bringing together the entire industry—design, fabrication, assembly, and test—under one roof. From the industry’s leading technical conference and professional development courses to an innovation-driven exhibit floor with the industry’s leading equipment manufacturers and product innovators, APEX EXPO 2026 offers the opportunity to transform tomorrow today. Connect with peers and explore solutions that are transforming the electronics manufacturing ecosystem. Download the Official APEX EXPO App today!