理財周刊1087期: 先進封裝崛起

· 理財周刊
eBook
100
Pages

About this eBook

全球半導體軍備競賽方興未艾,日、德爭取台積電設廠,南韓要建世界最大半導體基地。而台積電先進製程成為兵家必爭的焦點,台灣相關先進封裝設備廠,將隨台積電出征前進美國,未來潛在商機爆發力可觀。...


請看《理財周刊》1087期更多精采內容:

◆ 當前建築產業最大風險來自營建成本

◆ 台積電3D先進封裝後市旺

◆ 聯準會通膨概念股行情結束?

◆ 虛擬貨幣超前部署 完善用戶權益

◆ 期貨操作20年心路歷程

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