About this ebook
The primary aim of the proceeding is the combined coverage of the electronic test of devices, boards and systems—covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement at the advanced level. Such an approach enables the engineer to take into account the essential mechanical properties of the material itself and special features of practical implementation, including manufacturing technology, experimental results, and design characteristics.
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