Development of Packaging and Products for Use in Microwave Ovens

Peter Pesheck · Matthew Lorence

2009年7月 · Elsevier

關於這本電子書

The efficient design of microwave food products and associated packaging materials for optimum food quality and safety requires knowledge of product dielectric properties and associated heating mechanisms, careful consideration of product geometry, knowledge of modern packaging and ingredient technologies, and application of computer simulation, statistics and experimental design. Integrated knowledge and efficient application of these tools is essential for those developing food products in this demanding field.

Development of packaging and products for use in microwave ovens provides a focused and comprehensive review for developers. Part one discusses the principles of microwave heating and ovens, with an emphasis on the effect of food dielectric properties and geometry on heating uniformity and optimising the flavours and colours of microwave foods. Microwave packaging materials and design are discussed in Part two; chapters cover rigid packaging, susceptors and shielding. Product development, food, packaging and oven safety is the topic of Part three. Computer modelling of microwave products and active packaging is discussed in Part four.

Written by a distinguished team of international contributors, Development of packaging and products for use in microwave ovens is a valuable resource for those in the food and packaging industries.

• Comprehensively reviews the principles of microwave heating and ovens assessing the effect of food dielectric properties on heating uniformity
• Thoroughly reviews microwave packaging materials and design including testing and regulatory issues
• Features a seven page section of colour diagrams to show heat distributions

關於作者

Peter Pesheck is currently Principal at Food Biophysics, LLC. In his 34-year R&D career at Pillsbury and General Mills he worked primarily in cross-business Strategic Technology groups, where he specialized in structure-function relationships, microscopy, modeling, microwave heating (food dielectric properties, simulation, product design and problem resolution), and wheat flour doughs and their structural transformations in proofing and baking. He has published 4 papers in reviewed journals and holds 19 U.S. patents.

Matthew Lorence is currently a Packaging Technology Manager at Bellisio Foods, Inc. He is a leader in the field of packaging R&D for consumer and industrial products, and medical devices. He was previously Packaging Technology Manager at General Mills. He holds 13 U.S. patents and has extensive experience in identifying, developing, and commercializing convenient Total Product Offerings leveraging Open Innovation for new packaging and product technologies.