ກ່ຽວກັບປຶ້ມ e-book ນີ້
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
ໃຫ້ຄະແນນ e-book ນີ້
ບອກພວກເຮົາວ່າທ່ານຄິດແນວໃດ.
ອ່ານຂໍ້ມູນຂ່າວສານ
ສະມາດໂຟນ ແລະ ແທັບເລັດ
ຕິດຕັ້ງ ແອັບ Google Play Books ສຳລັບ Android ແລະ iPad/iPhone. ມັນຊິ້ງຂໍ້ມູນໂດຍອັດຕະໂນມັດກັບບັນຊີຂອງທ່ານ ແລະ ອະນຸຍາດໃຫ້ທ່ານອ່ານທາງອອນລາຍ ຫຼື ແບບອອບລາຍໄດ້ ບໍ່ວ່າທ່ານຈະຢູ່ໃສ.
ແລັບທັອບ ແລະ ຄອມພິວເຕີ
ທ່ານສາມາດຟັງປຶ້ມສຽງທີ່ຊື້ໃນ Google Play ໂດຍໃຊ້ໂປຣແກຣມທ່ອງເວັບຂອງຄອມພິວເຕີຂອງທ່ານໄດ້.
eReaders ແລະອຸປະກອນອື່ນໆ
ເພື່ອອ່ານໃນອຸປະກອນ e-ink ເຊັ່ນ: Kobo eReader, ທ່ານຈຳເປັນຕ້ອງດາວໂຫຼດໄຟລ໌ ແລະ ໂອນຍ້າຍມັນໄປໃສ່ອຸປະກອນຂອງທ່ານກ່ອນ. ປະຕິບັດຕາມຄຳແນະນຳລະອຽດຂອງ ສູນຊ່ວຍເຫຼືອ ເພື່ອໂອນຍ້າຍໄຟລ໌ໄໃສ່ eReader ທີ່ຮອງຮັບ.
