Scanning Probe Lithography

Springer Science & Business Media
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Scanning Probe Lithography (SPL) describes recent advances in the field of scanning probe lithography, a high resolution patterning technique that uses a sharp tip in close proximity to a sample to pattern nanometer-scale features on the sample. SPL is capable of patterning sub-30nm features with nanometer-scale alignment registration. It is a relatively simple, inexpensive, reliable method for patterning nanometer-scale features on various substrates. It has potential applications for nanometer-scale research, for maskless semiconductor lithography, and for photomask patterning.
The authors of this book have been key players in this exciting new field. Calvin Quate has been involved since the beginning in the early 1980s and leads the research time that is regarded as the foremost group in this field. Hyongsok Tom Soh and Kathryn Wilder Guarini have been the members of this group who, in the last few years, have brought about remarkable series of advances in SPM lithography. Some of these advances have been in the control of the tip which has allowed the scanning speed to be increased from mum/second to mm/second. Both non-contact and in-contact writing have been demonstrated as has controlled writing of sub-100 nm lines over large steps on the substrate surface. The engineering of a custom-designed MOSFET built into each microcantilever for individual current control is another notable achievement. Micromachined arrays of probes each with individual control have been demonstrated. One of the most intriguing new aspects is the use of directly-grown carbon nanotubes as robust, high-resolution emitters.
In this book the authors concisely and authoritatively describe the historical context, the relevant inventions, and the prospects for eventual manufacturing use of this exciting new technology.
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Springer Science & Business Media
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Published on
Mar 14, 2013
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Technology & Engineering / Electrical
Technology & Engineering / Electronics / Circuits / General
Technology & Engineering / Electronics / General
Technology & Engineering / Manufacturing
Technology & Engineering / Materials Science / General
Technology & Engineering / Technical & Manufacturing Industries & Trades
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The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J.
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