Giới thiệu về sách điện tử này
Up-to-date practitioner’s guide on LED packaging technologies, with application examples from relevant industries, historical insight, and outlook
LED Packaging Technologies provides expert insight into current and future trends in LED packaging technologies, discussing the fundamentals of LED packaging technologies, from electrical contact design, thermal management and optical emission, and extraction, to manufacturing technologies, including the JEDEC testing standards, followed by accounts on the main applications of these LED packages in the automotive, consumer electronics, and lighting industries.
LED Packaging Technologies includes information on:
- History of primitive lighting in human civilization to the invention of modern LEDs based lighting, and historic evolution of LED packaging technology
- Basic light emission and extraction technology in LED packages, covering package design impacting light emission and extraction
- Medical industry applications of LEDs, especially in healthcare treatments, such as in skin rejuvenation and wound healing and closures
- Quantum confinement phenomena and size-dependent optical properties of quantum dots, and the advancement of future quantum dot LEDs
Covering the fundamentals, design, and manufacturing of LED packaging technology and assisting in removing some of the barriers in the development of LED packaging and new applications, LED Packaging Technologies is an essential source of information for engineers in the LED and lighting industries, as well as researchers in academia.
Giới thiệu tác giả
Luruthudass Annaniah is the Director of Product Development at ams OSRAM Penang, Malaysia, and an Adjunct Lecturer of University Technology Petronas, Malaysia.
Mohamed Salleh M. Saheed works at Infineon Technologies (Kulim), Malaysia, as Technical Project Leader in Technology, Development and Innovation Department, specializing in Semiconductor Power Devices for automotive and industrial applications.
Rajan Jose is a senior Professor in the Universiti Malaysia Pahang (UMP), Malaysia, and is the Associate Editor-in-Chief of the Springer Nature journal Materials Circular Economy.
