Materials for High-Temperature Semiconductor Devices
National Research Council · Division on Engineering and Physical Sciences · National Materials Advisory Board · Commission on Engineering and Technical Systems · Committee on Materials for High-Temperature Semiconductor Devices
Sep 1995 · National Academies Press
I-Ebook
136
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Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.
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