Microwave and Millimeter-Wave Electronic Packaging

Rick Sturdivant

2013 թ. դեկ · Artech House

Այս էլ․ գրքի մասին

Packaging of electronic components at microwave and millimeter-wave
frequencies requires the same level of engineering effort for lower
frequency electronics plus a set of additional activities which are
unique due to the higher frequency of operation. This resource presents
you with the electronic packaging issues unique to microwave and
millimeter-wave frequencies and reviews lower frequency packaging
techniques so they can be adapted to higher frequency designs. You are
provided with 30 practical examples throughout the book, as well as
three free downloadable software analysis programs.

Հեղինակի մասին

Rick Sturdivant has 23 years of industry experience in the design of modules, packages, and integrated circuits for microwave and millimeter-wave applications. He currently works as a consultant and in business development. He earned his M.S. in electrical engineering from UCLA.