Bu e-kitob haqida
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Bu e-kitobni baholang
Fikringizni bildiring.
Qayerda o‘qiladi
Smartfonlar va planshetlar
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Noutbuklar va kompyuterlar
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Kitob o‘qish uchun mo‘ljallangan qurilmalar
Kitoblarni Kobo e-riderlar kabi e-siyoh qurilmalarida oʻqish uchun faylni yuklab olish va qurilmaga koʻchirish kerak. Fayllarni e-riderlarga koʻchirish haqida batafsil axborotni Yordam markazidan olishingiz mumkin.
