Tribology of Abrasive Machining Processes

Ioan D. Marinescu‏ · W. Brian Rowe‏ · Boris Dimitrov‏ · Ichiro Inaski‏

מאי 2004 · Elsevier

מידע על הספר הדיגיטלי הזה

Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.

על המחבר

Ioan D. Marinescu is Professor and Director of the Precision Micromachining Center at The University of Toledo, Ohio, USA, and CEO of Advanced Manufacturing Solutions, LLC. His research interests include manufacturing processes, grinding, tribology, advanced materials, and machining of brittle materials.W. Brian Rowe is Consulting Director and Emeritus Professor of Mechanical Engineering at Liverpool John Moores University, Liverpool, UK. He is also former Director of the Advanced Manufacturing Technology and Tribology Research Laboratory. Professor Rowe is a widely respected researcher in the fields of tribology and grinding. He has authored many books on grinding and grinding machine technology, also on bearing analysis and design.Boris Dimitrov is a Consulting Engineer in mechanics and chemistry, former Chief Scientist of the Romanian Research Institute of Applied Mechanics, and a former member of the Romanian Institute for Precision Mechanics in Bucharest.