Wire Bonding in Microelectronics: Edition 3

George Harman

Jun 2009 · McGraw Hill Professional

About this ebook

The Industry Standard Guide to Wire Bonding--Fully Updated

The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

• Ultrasonic bonding systems and technologies, including high-frequency systems
• Bonding wire metallurgy and characteristics, including copper wire
• Wire bond testing
• Gold-aluminum intermetallic compounds and other interface reactions
• Gold and nickel-based bond pad plating materials and problems
• Cleaning to improve bondability and reliability
• Mechanical problems in wire bonding
• High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds
• Copper, low-dielectric-constant (Cu/Lo-k) technology and problems
• Wire bonding process modeling and simulation

CD includes all the book's full-color figures plus animations

Ratings and reviews

The gold plating section, 6A.5 Gold Plating Standards, is incorrect. In Table 6A-1, under ASTM B488-01 (2006), it lists Type I as 99.9% gold min. This is not correct. Type I is 99.7%. Type III is 99.9%. The ASTM B488 was revised to match the gold purity types in the MIL-G-45204 standard.

About the author

George G. Harman is a Fellow of the National Institute of Standards and Technology's Semiconductor Electronics Division.