The updated Second Edition contains many new figures, as well as new and/or improved chapters on:
Providing the latest research and development information, along with numerous examples of successful home appliance, aviation, naval, automotive electronics, industrial motor drive, and grid interface for renewable energy products, this edition highlights advancements in packaging technologies, tackles the advent of hybrid circuits able to incorporate control and power stages within the same package, and examines design for reliability from the system level perspective.
Author of three US patents, Dorin O. Neacsu is associate professor for, and holds an M.Sc and Ph.D in electronics from, the Technical University of Iasi, Romania. He also holds an M.Sc in engineering management from Tufts Gordon Institute, Medford, Massachusetts, USA. The well-published, senior IEEE member has worked with TAGCM-SUT Iasi, Romania; Universite du Quebec a Trois Rivieres, Canada; General Motors/Delphi, Indianapolis, Indiana, USA; International Rectifier, El Segundo, California, USA; SatCon, Boston, Massachusetts, USA; Azure Dynamics/Solectria, Woburn, Massachusetts, USA; University of New Orleans, Louisiana, USA; Massachusetts Institute of Technology, Cambridge, USA; and United Technologies Research Center, East Hartford, Connecticut, USA.