Dr Kenji Uchino is a pioneer in piezoelectric actuators, Professor of Electrical Engineering at Penn State University, and Director of the International Center for Actuators and Transducers. He is also the founder and Senior VP & CTO of Micromechatronics, Inc. He has authored 277 papers, 54 books and 26 patents.
The volume includes chapters focusing specifically on electron and proton irradiation of silicon, point defects in zinc oxide and gallium nitride, ion implantation defects and shallow junctions in silicon and germanium, and much more. It will help support students and scientists in their experimental and theoretical paths.Expert contributorsReviews of the most important recent literatureClear illustrationsA broad view, including examination of defects in different semiconductors
The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.
The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.
As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as:
• Tamper-proof adhesives for electronic security devices.
• Bio-compatible adhesives for implantable medical devices.
• Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market).
• Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionalsProvides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic deviceDiscusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel
Filling the informational void, this collection of information reviews state-of-the-art research and development trends reflecting nano and optical technologies, environmental regulation, and alternative energy sources. Like the first edition, which became a standard in the field, this volume provides a general introduction to ferroelectrics with theoretical background. It then addresses practical design and device manufacturing, including recently developed processes and applications. Updating old data with a forecast of future developments, the text analyzes improvements to original ferroelectric devices to aid the design process of new ones.
The second edition includes new sections on:
Size effect on ferroelectricity
Micro mass sensor
Piezoelectric energy harvesting
Light valves and scanners
Multi-ferroic devices, including magneto-electric sensors
Uchino provides a general introduction to the theoretical background of ferroelectric devices, practical materials, device designs, drive/control techniques, and typical applications. He presents frequently asked questions from students, lab demonstrations for practical understanding, and "check point" quizzes and model solutions to monitor understanding.
After a thorough exploration of ferroelectric devices and their past, this book looks to the industry’s future, assessing market size and remaining reliability/lifetime issues. The author also unveils his strategy for developing "best-selling" ferroelectric devices.