Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research

· ·
· WSPC Series in Advanced Integration and Packaging 第 3 本图书 · World Scientific
电子书
472
符合条件

关于此电子书

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

为此电子书评分

欢迎向我们提供反馈意见。

如何阅读

智能手机和平板电脑
只要安装 AndroidiPad/iPhone 版的 Google Play 图书应用,不仅应用内容会自动与您的账号同步,还能让您随时随地在线或离线阅览图书。
笔记本电脑和台式机
您可以使用计算机的网络浏览器聆听您在 Google Play 购买的有声读物。
电子阅读器和其他设备
如果要在 Kobo 电子阅读器等电子墨水屏设备上阅读,您需要下载一个文件,并将其传输到相应设备上。若要将文件传输到受支持的电子阅读器上,请按帮助中心内的详细说明操作。