Electrical Insulation Breakdown and Its Theory, Process, and Prevention: Emerging Research and Opportunities: Emerging Research and Opportunities

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In electrical engineering manufacturing, one of the most important processes stems from making sure the material used to distribute the electrical current is safe and operating correctly. The precarious nature of electricity makes developing innovative material for advanced safety a high-ranking priority for researchers.

Electrical Insulation Breakdown and Its Theory, Process, and Prevention: Emerging Research and Opportunities provides innovative insights into the latest developments and achievements in high voltage insulation breakdown. Featuring topics such as nanodielectrics, thermal stability, and transmission technology, it is designed for engineers, including those that work with high voltage power systems, researchers, practitioners, professionals, and students interested in the upkeep and practice of electric material safety.

作者简介

Boxue Du received the M.E. degree in electrical engineering from Ibaraki University and the Ph.D. degree from Tokyo University of A&T. Since 2002 he has been a Professor and Director-founder of the Institute of High Voltage at the School of Electrical and Information Engineering, Tianjin University, China. His research interests are focused on dielectric failure mechanisms of polymer insulating materials, electrical insulation technology and application of polymer dielectrics under various extreme environments such as cryogenic, high temperature, high altitude, gamma-ray irradiation and high-intensity magnetic field. He has published 4 books and 8 book chapters in Polymer Dielectrics, and authored about 500 papers and over 150 of them published in IEEE Transactions. He has also served industry and start-ups as a consultant, i.e. an IEEE China Council Council on Superconductivity Chapter, Chief Committee Member; Chinese Society of Electrical Engineering, High Voltage New Technology Committee Member. He is a Fellow of IET, senior member of IEEE and CSEE, Committee Member at several WG in CIGRE and IEEE Standards. He is an Editorial Boards Member of IET High Voltage; Chinese Journal of High Voltage Engineering. He is an Associate Editor of the IEEE Transactions on Dielectrics and Electrical Insulation, an Associate Editor of IEEE Access and a Subject Editor of the IET Nanodielectrics.

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